Zobrazeno 1 - 3
of 3
pro vyhledávání: '"M.J. van der Reijden"'
Autor:
Wendy H. Yeh, M. Op de Beeck, Eddy Kunnen, Erik Sleeckx, R. Schreutelkamp, Patrick Jaenen, Bart Degroote, M.J. van der Reijden
Publikováno v:
The 17th Annual SEMI/IEEE ASMC 2006 Conference.
The objective of this work is to enable the manufacturing of features with most aggressive pitches available to date using APF as a strippable hard mask (HM). Essential for the capability of printing small and in particular dense features is the cont
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::733a86c34e2a82ce33c2615dfa652a91
https://doi.org/10.1109/asmc.2006.1638721
https://doi.org/10.1109/asmc.2006.1638721
Autor:
M. Swaanen, S. Harzenetter, M. Gerwig, F. Rommel, J. Zondag, H. Schoel, J. Cavelaars, I. Englard, R. Poschadel, H. Sahr, K. Mast, M. Junker, T. King, R. Schreutelkamp, Liang Shi, M.J. van der Reijden, B. Hein
Publikováno v:
Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI.
Increased process equipment complexity and cost related to tool down time stimulate a stronger partnership between chip manufacturer and process equipment vendor to minimize the risk to production. Applied Materials is engaged in various process equi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9bc345800362f3af61c8860cdb76ff9f
https://doi.org/10.1109/asmc.2003.1194460
https://doi.org/10.1109/asmc.2003.1194460
Conference
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