Zobrazeno 1 - 10
of 47
pro vyhledávání: '"M.H. Somerville"'
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 8:283-288
We have studied the electrical degradation of RF-power PHEMTs by means of in situ 2-D light-emission measurements. Electroluminescence originates in the recombination of holes that have been generated by impact ionization. The local light intensity,
Publikováno v:
IEEE Transactions on Electron Devices. 47:922-930
We present a new model for the the kink effect in InAlAs/InGaAs HEMTs. The model suggests that the kink is due to a threshold voltage shift which arises from a hole pile-up in the extrinsic source and an ensuing charging of the surface and/or the buf
Publikováno v:
IEEE Transactions on Electron Devices. 47:1560-1565
We have developed a methodology to diagnose the physical mechanisms limiting the manufacturing uniformity of millimeter-wave power InAlAs/InGaAs HEMT's on InP. A statistical analysis was carried out on dc figures of merit obtained from a large number
Publikováno v:
IEEE Transactions on Electron Devices. 46:1087-1093
We have carried out a systematic study of on-state breakdown in a sample set of InAlAs/InGaAs HEMT's using a new gate current extraction technique in conjunction with sidegate and temperature-dependent measurements. We find that as the device is turn
Autor:
J.A. del Alamo, M.H. Somerville
Publikováno v:
IEEE Journal of Solid-State Circuits. 34:1204-1211
In spite of their outstanding transport characteristics, InP high-electron mobility transistors (HEMTs) deliver lower output power than GaAs pseudomorphic HEMTs (PHEMTs) throughout most of the millimeter-wave regime. However, the superior power-added
Publikováno v:
IEEE Transactions on Electron Devices. 45:9-13
Conventional techniques to extract channel mobility, /spl mu/, and sheet carrier concentration, n/sub s/, in heterostructure field-effect transistors (HFETs) do not account for the distributed nature of the device. This can result in substantial erro
Autor:
Christopher W. Leitz, H. Badawi, T. A. Langdo, Zhiyuan Cheng, I. Lauer, Mayank T. Bulsara, Anthony J. Lochtefeld, D.A. Antoniadis, M.H. Somerville, Matthew T. Currie, G. Braithwaite, J.G. Fiorenza
Publikováno v:
IEEE Electron Device Letters. 25:83-85
Strained silicon-on-insulator (SSOI) is a new material system that combines the carrier transport advantages of strained Si with the reduced parasitic capacitance and improved MOSFET scalability of thin-film SOI. We demonstrate fabrication of highly
Publikováno v:
IEEE Electron Device Letters. 22:565-567
We present a new technique for determining the dominant breakdown mechanism in InAlAs-InGaAs high-electron mobility transistors. By exploiting both the temperature dependence and the bias dependence of different physical mechanisms, we are able to di
Publikováno v:
IEEE Electron Device Letters. 19:405-407
We present a new simple three-terminal technique for measuring the on-state breakdown voltage in HEMTs. The gate current extraction technique involves grounding the source, and extracting a constant current from the gate. The drain current is then ra
Publikováno v:
IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..
We have studied the electrical degradation of RF power PHEMTs by means of light-emission measurements performed during bias-stress experiments. We show that electrical degradation can proceed in a highly non-uniform manner across the width of the dev