Zobrazeno 1 - 10
of 306
pro vyhledávání: '"M.-J. Kao"'
Publikováno v:
Advances in Materials Science and Engineering, Vol 2014 (2014)
Chemical mechanical polishing (CMP) technology is extensively used in the global planarization of highly value-added and large components in the aerospace industry. A nanopowder of SiO2 was prepared by the sol-gel method and was compounded into polis
Externí odkaz:
https://doaj.org/article/6729d5c6fc114647bc6c180bb327e3dc
Publikováno v:
Journal of Fluid Mechanics. 847:186-227
The main goal of this paper is to provide insights into swash flow dynamics, generated by a non-breaking solitary wave on a steep slope. Both laboratory experiments and numerical simulations are conducted to investigate the details of runup and rundo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d698545c07933256a2f6b343a8583a3e
https://doi.org/10.1017/jfm.2018.321
https://doi.org/10.1017/jfm.2018.321
Akademický článek
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Autor:
T. C. Tien, Wei-Su Chen, H. Y. Lee, M.-J. Kao, Amit Prakash, Ming-Jinn Tsai, Frederick T. Chen, Chao-Sung Lai, Siddheswar Maikap
Publikováno v:
Solid-State Electronics. 77:35-40
Resistive switching properties of a memory device in an IrO x /TaO x /WO x /W structure have been investigated. High-resolution transmission electron microscopy image has shown the formation of a bilayer structure of TaO x /WO x which is further conf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1199adc244e7b04e8b2c51a9d0ff281d
https://doi.org/10.1016/j.sse.2012.05.028
https://doi.org/10.1016/j.sse.2012.05.028
Publikováno v:
Journal of Periodontal Research. 48:135-143
Chang P-C, Chien L-Y, Ye Y, Kao M-J. Irradiation by light-emitting diode light as an adjunct to facilitate healing of experimental periodontitis in vivo. J Periodont Res 2013; 48: 135–143. © 2012 John Wiley & Sons A/S Background and Objective: Thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::606c4892982b0293b4c684cdaf89ec79
https://doi.org/10.1111/j.1600-0765.2012.01511.x
https://doi.org/10.1111/j.1600-0765.2012.01511.x
Autor:
M.-J. Kao, M.-J. Tsai, Amit Prakash, Siddheswar Maikap, Wei-Su Chen, Heng Yuan Lee, Frederick T. Chen
Publikováno v:
ECS Transactions. 45:379-385
The impact of switching layer thickness on the resistive memory performance and uniformity has been investigated in a simple stack of IrOx/TaOx/W fabricated. The formation of amorphous TaOx and nanocrystalline WOx layers are confirmed from HRTEM imag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b6457349161e898dbe4986cf268106a
https://doi.org/10.1149/1.3700903
https://doi.org/10.1149/1.3700903
Autor:
Po-Chun Chang, Y.-P. Kuo, Lum Peng Lim, C. Lei, M.-C. Chung, Alex S.M. Dovban, L.-Y. Chien, L.Y. Chong, C.-H. Chen, M.-J. Kao, H.-C. Chiang, Chi-Hwa Wang
Publikováno v:
Journal of Dental Research. 91:618-624
Heat generated during implant osteotomy might lead to osteonecrosis and delayed bone repair, thus resulting in impaired early osseointegration and fixation of bone-anchoring devices. In this study, we proposed to overcome heat-induced injury to bone
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6cd37ba4c46b911ba9a493d23ed36e80
https://doi.org/10.1177/0022034512445194
https://doi.org/10.1177/0022034512445194
Publikováno v:
Journal of Mechanics. 28:191-207
This paper presents the flow structure under a partially inundated bridge deck measured by using particle image velocimetry (PIV) and flow visualization techniques. The approaching flow was subcritical having Froude number F in the range 0.12 ∼ 0.5
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ae08b1e9dec57d4bba6999ebcb60c88
https://doi.org/10.1017/jmech.2012.20
https://doi.org/10.1017/jmech.2012.20
Autor:
J. H. Lau, C.-J. Zhan, P.-J. Tzeng, C.-K. Lee, M.-J. Dai, H.-C. Chien, Y.-L. Chao, W. Li, S.-T. Wu, J.-F. Hung, R.-M. Tain, C.-H. Lin, Y.-C. Hsin, C.-C. Chen, S.-C. Chen, C.-Y. Wu, J.-C. Chen, C.-H. Chien, C.-W. Chiang, H.-H. Chang, W.-L. Tsai, R.-S. Cheng, S.-Y. Huang, Y.-M. Lin, T.-C. Chang, C.-D. Ko, T.-H. Chen, S.-S. Sheu, S.-H. Wu, Y.-H. Chen, W.-C. Lo, T.-K. Ku, M.-J. Kao, D.-C. Hu
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 8:171-178
The feasibility of a 3D IC integration SiP has been demonstrated in this investigation. The heart of this SiP is a TSV (through-silicon via) interposer with an RDL (redistribution layer) on both sides, IPD (integrated passive devices), and SS (stress
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::678f3d464ab99ca88abd0b1a0d2dc22b
https://doi.org/10.4071/imaps.306
https://doi.org/10.4071/imaps.306
Autor:
Jie Xue, T-H Chen, S. Chung, John H. Lau, T-K Ku, C-J Zhan, Y. Lee, P. Chang, S-C Chen, M-J Kao, H. Fu, C-T Ko, Y. Hsu, Li Li, M-J Dai, W. Tsai, W-C Lo, C-K Lee, P-J Tzeng, Z. Hsiao, Y-H Chen, M. Brillhart, J. Huang, S-W Chen
Publikováno v:
International Symposium on Microelectronics. 2011:000650-000656
In this study, the wafer bumping and characterization of fine-pitch lead-free solder microbumps on 300mm wafer for 3D IC integration are investigated. Emphasis is placed on the Cu-plating solutions (conformal and bottom-up). Also, the amount of Cu an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13c1100ae76a72ff83fb3f0d772e7338
https://doi.org/10.4071/isom-2011-wa6-paper2
https://doi.org/10.4071/isom-2011-wa6-paper2