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pro vyhledávání: '"M. Wasil Malik"'
Autor:
Sahar Jaddi, M. Wasil Malik, Bin Wang, Nicola M. Pugno, Yun Zeng, Michael Coulombier, Jean-Pierre Raskin, Thomas Pardoen
Publikováno v:
Nature Communications, Vol 15, Iss 1, Pp 1-11 (2024)
Abstract Fail-safe design of devices requires robust integrity assessment procedures which are still absent for 2D materials, hence affecting transfer to applications. Here, a combined on-chip tension and cracking method, and associated data reductio
Externí odkaz:
https://doaj.org/article/69e41d9669a042af814cce2b420f62df