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pro vyhledávání: '"M. Vrazel"'
Akademický článek
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Autor:
C. Chun, V.M. Hietala, A.J. Kim, Franklin Bien, Stephen E. Ralph, M. Maeng, S. Chandramouli, J. Laskar, B. Schmukler, S. Bajekal, C. Pelard, M. Vrazel, Youngsik Hur, Edward Gebara
Publikováno v:
IEEE Journal of Solid-State Circuits. 39:1659-1670
In this paper, we present integrated circuit solutions that enable high-speed data transmission over legacy systems such as short reach optics and electrical backplanes. These circuits compensate for the most critical signal impairments, intersymbol
Autor:
Martin A. Brooke, Elias N. Glytsis, A. Chellapa, T. Nonaka, Jaemin Shin, J. Hall, Thomas K. Gaylord, T. Suzuki, Nan Marie Jokerst, D.L. Geddis, M. Vrazel, Sang-Yeon Cho, Ricardo A. Villalaz
Publikováno v:
IEEE Transactions on Advanced Packaging. 27:376-385
This paper explores design options for planar optical interconnections integrated onto boards, discusses fabrication options for both beam turning and embedded interconnections to optoelectronic devices, describes integration processes for creating e
Autor:
Martin A. Brooke, April S. Brown, J. Laskar, M. Vrazel, Jae Joon Chang, D.S. Wills, Nan Marie Jokerst, Sungyong Jung, Youngjoong Joo
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 6:1231-1239
The integration and packaging of optoelectronic devices with electronic circuits and systems has growing application in many fields, ranging from long to micro haul links. An exploration of the opportunities, integration technologies, and some recent
Autor:
G. Dagnall, April S. Brown, M. Vrazel, S.W. Bond, Sek M. Chai, O. Vendier, Martin A. Brooke, D.S. Wills, Sungyong Jung, A. Lopez-Lagunas, Myunghee Lee, Nan Marie Jokerst
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 5:276-286
We present for the first time a three-dimensional (3D) Si CMOS interconnection system consisting of three layers of optically interconnected hybrid integrated Si CMOS transceivers. The transceivers were fabricated using 0.8-/spl mu/m digital Si CMOS
Autor:
Danet M. Vrazel, Abida K. Haque
Publikováno v:
Bulletin of Environmental Contamination and Toxicology. 60:620-625
Occupational exposure to asbestos has been on decline in the US over the last 2-3 decades. There is, however, concern that environmental asbestos exposure is increasing through the use of asbestos-containing products (Churg 1988; Edelman 1988; Jarvho
Autor:
Z. Nami, A.J. Kim, B. Schmukler, A. Raghavan, J. Laskar, S. Bajekal, Chang-Ho Lee, Franklin Bien, Edward Gebara, M. Vrazel
Publikováno v:
Proceedings. 45th Annual IEEE Symposium on Foundations of Computer Science.
A multi-rate crosstalk canceller for active cancellation of near end cross talk (NEXT) caused by a single aggressor in a backplane channel environment has been demonstrated in this paper. The proposed IC enhances the performance of existing legacy ba
Autor:
Jae Joon Chang, Nan Marie Jokerst, Mikkel A. Thomas, Martin A. Brooke, D.S. Wills, April S. Brown, M. Vrazel, J. Cross, O. Vendier, Myunghee Lee, S.W. Bond, J. Laskar, Sungyong Jung, Youngjoong Joo
Publikováno v:
1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting. IEEE Lasers and Electro-Optics Society 1999 Annual Meeting (Cat. No.99CH37009).
Interconnections are a limiting cost and performance factor in present electronic systems, and become even more critical as wiring, processing densities, and speeds increase. Historically, optical interconnections have been most successful in long ha
Publikováno v:
25th Annual Technical Digest 2003. IEEE Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2003..
Equalization is emerging as a necessary technique to achieve next generation data rates in high-speed communications systems. Equalization has been used for many decades in lower speed systems; however, its use in high-speed systems is new. In this p
Autor:
V.M. Hietala, S. Bajekal, J. Laskar, A.J. Kim, E.J. Peddi, M. Vrazel, C. Pelard, E. Gebara, S.E. Ralph
Publikováno v:
25th Annual Technical Digest 2003. IEEE Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2003..
An analog feed forward equalizer optimized for 5 Gsym/s multilevel signaling transmission over multimode fiber has been implemented using a 2 /spl mu/m GaAs HBT process. The equalizer helps mitigate the intersymbol interference induced by the limited