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pro vyhledávání: '"M. Vakilzadeh Moghaddam"'
Autor:
M. Vakilzadeh Moghaddam, S. Cyrusian
Publikováno v:
Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging.
High frequency performance of chip-to-chip interconnections is primarily limited by the structure of chip mounting, vias and bends. The last two problems are investigated by full wave simulation technique. A great performance improvement is achieved.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::431966b647cd6d2d0c7eaf895e137bd8
https://doi.org/10.1109/epep.1994.594054
https://doi.org/10.1109/epep.1994.594054
