Zobrazeno 1 - 1
of 1
pro vyhledávání: '"M. V. Marsh"'
Publikováno v:
Circuit World. 19:63-70
The technological development and characteristics of an innovative process and composition for immersion plating and fusing of a solderable tin/lead deposit over copper are discussed. The process offers a viable alternative to hot air solder levellin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c210278c598c12e1d9fda2c8d506736
https://doi.org/10.1108/eb046192
https://doi.org/10.1108/eb046192
