Zobrazeno 1 - 10
of 124
pro vyhledávání: '"M. Tanniru"'
Autor:
B. Sell, S. An, J. Armstrong, D. Bahr, B. Bains, R. Bambery, K. Bang, D. Basu, S. Bendapudi, D. Bergstrom, R. Bhandavat, S. Bhowmick, M. Buehler, D. Caselli, S. Cekli, Vrsk. Chaganti, Y. J. Chang, K. Chikkadi, T. Chu, T. Crimmins, G. Darby, C. Ege, P. Elfick, T. Elko-Hansen, S. Fang, C. Gaddam, M. Ghoneim, H. Gomez, S. Govindaraju, Z. Guo, W. Hafez, M. Haran, M. Hattendorf, S. Hu, A. Jain, S. Jaloviar, M. Jang, J. Kameswaran, V. Kapinus, A. Kennedy, S. Klopcic, D. Krishnan, J. Leib, Y.-T. Lin, N. Lindert, G. Liu, O. Loh, Y. Luo, S. Mani, M. Mleczko, S. Mocherla, P. Packan, M. Paik, A. Paliwal, R. Pandey, K. Patankar, L. Pipes, P. Plekhanov, C. Prasad, M. Prince, G. Ramalingam, R. Ramaswamy, J. Riley, J. R. Sanchez Perez, J. Sandford, A. Sathe, F. Shah, H. Shim, S. Subramanian, S. Tandon, M. Tanniru, D. Thakurta, T. Troeger, X. Wang, C. Ward, A. Welsh, S. Wickramaratne, J. Wnuk, S. Q. Xu, P. Yashar, J. Yaung, K. Yoon, N. Young
Publikováno v:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
Autor:
Yeoh Andrew W, W. Han, Manvi Sharma, J. Shin, I. Post, M. Tanniru, T. Mule, Madhavan Atul, Gerald S. Leatherman, Kevin J. Fischer, Y-H. Wu, M. Sprinkle, Prasun Sinha, S. Anand, J. Steigerwald, S. Nigam, V. Souw, C. Ganpule, M. Asoro, Haran Mohit K, K-S. Lee, C. Pelto, P. Yashar, S. Samarajeewa, M. Mori, A. Tripathi, S. Kirby, C. Auth, M. Aykol, H. Hiramatsu, K. Marla, H. Jeedigunta, V. Chikarmane, M. Buehler, Nicholas J. Kybert
Publikováno v:
2018 IEEE International Interconnect Technology Conference (IITC).
This paper describes Intel's 10nm highperformance logic technology interconnect stack featuring 13 metal layers comprising two self-aligned quad patterned and four self-aligned double patterned layers. Quad patterned interconnect layers are introduce
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Autor:
M. Tanniru, Raja Devesh Kumar Misra
Publikováno v:
Materials Science and Engineering: A. 424:53-70
The micromechanism of plastic deformation and susceptibility to stress whitening during tensile straining of 20% calcium carbonate-reinforced polyethylene micrometric composites is investigated and compared with the un-reinforced polyethylene under i
Publikováno v:
Polymer. 47:2133-2146
The mechanical response of clay–reinforced polyethylene nanocomposite is investigated and the behavior compared with the un-reinforced polyethylene under identical conditions of processing. The micromechanism of plastic deformation during impact lo
Autor:
Raja Devesh Kumar Misra, M. Tanniru
Publikováno v:
Materials Science and Engineering: A. 405:178-193
The micromechanism of plastic deformation during impact loading of 20% calcium carbonate-reinforced polyethylene micrometric composite is investigated through scanning electron microscopy and atomic force microscopy and the behavior compared with the
Publikováno v:
Materials Science and Engineering: A. 404:208-220
The scratch-induced surface damage of neat and calcium carbonate-reinforced high density polyethylene is described in terms of characteristics of scratch morphology and scratch deformation parameters. Under identical test conditions, calcium carbonat
Publikováno v:
Materials Science and Technology. 21:883-892
The paper describes the precipitation behaviour in a thermomechanically processed V bearing microalloyed steel containing small additions of Ti and Nb (0·007–0·008 wt-%) using analytical transmission electron microscopy. An intriguing aspect is t
Publikováno v:
Materials Science and Technology. 21:159-164
Stereological analysis was applied to quantify the ferrite–pearlite microstructure and relate it to the toughness of similar strength V–Nb–Ti and V microalloyed steels. The V–Nb–Ti and the V steel were characterised by average yield strengt