Zobrazeno 1 - 6
of 6
pro vyhledávání: '"M. Safwan Azmi"'
Morphological Characterization of Fabricated Aluminum Interdigitated Electrodes on Silicon Substrate
Publikováno v:
Advanced Materials Research. 1109:381-384
The purpose of this paper is to study the morphological characterization of aluminum interdigitated electrodes (IDE) of different gap sizes on silicon substrate. The electrodes were fabricated using standard photolithography process and were done so
Publikováno v:
Advanced Materials Research. 1109:376-380
The purpose of this paper is to give a review of the fabrication of nanostructure-based copper oxide biosensor. This paper briefly covers processes from silicon wafer cleaning, oxidation process, silicon nitride deposition, aluminum metal deposition,
Publikováno v:
2015 2nd International Conference on Biomedical Engineering (ICoBE).
This Detection of specific biomolecules increases interest in the development of biosensor especially for its applicability and complexity. Biomolecules and nanomaterials are the two issues that researchers used to improve electrical signal originati
Publikováno v:
2015 2nd International Conference on Biomedical Engineering (ICoBE).
The purpose of this paper is to study the effect of annealing time towards the copper films deposited through thermal evaporation process at constant temperature. The copper oxide nanowires are formed on glass substrates through thermal annealing pro
Publikováno v:
2014 IEEE Conference on Biomedical Engineering and Sciences (IECBES).
The purpose of this paper is to study the electrical characteristics of aluminum interdigitated electrodes (IDE) on silicon substrate for pH sensing application. The IDEs are fabricated using standard photolithography process. It is then tested for e
Autor:
M. Nasir Ayob, Fariz Hassan, A. Halim Ismail, Amar Faiz Zainal Abidin, M. Safwan Azmi, H. Hassan Basri
Publikováno v:
2012 International Symposium on Computer Applications and Industrial Electronics (ISCAIE).
Many studies had been conducted in improving the performance of large scale integration circuits that heavily depends on the interconnected routing in the circuits. Strategic choice of wire placement and buffer placement for very large scale integrat