Zobrazeno 1 - 10
of 61
pro vyhledávání: '"M. Sadeghinia"'
Publikováno v:
Desert, Vol 26, Iss 2, Pp 237-249 (2021)
Nebkha and the plant that creates it together form a system. nebkha formation parameters have a significant effect on the transfer rate of aeolian deposits. Adequate information on nebkha will help plan more accurately and efficiently and better mana
Externí odkaz:
https://doaj.org/article/d8d45ca70b544868b483e99da2f93111
Autor:
W.D. van Driel, I. Maus, L.J. Ernst, M. Sadeghinia, Heinz Pape, Guoqi Zhang, Kaspar M. B. Jansen
Publikováno v:
International Journal of Adhesion and Adhesives. 49:73-79
Interfacial delamination is known as one of the root causes of failure in microelectronic industry. Delamination toughness is strongly dependent on the temperature, the moisture content and on the so-called mode mixity of the stress state near the cr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a3e4c3b65c0a05c9e6a7e3686fb7a70
https://doi.org/10.1016/j.ijadhadh.2013.12.002
https://doi.org/10.1016/j.ijadhadh.2013.12.002
Akademický článek
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Publikováno v:
International Journal of Adhesion and Adhesives. 40:103-107
Epoxy Molding Compounds (EMCs), commonly based on epoxy resin, are used widely for encapsulation of chips in electronic devices for protection against mechanical, environmental, and chemical attack. The thermo-mechanical properties of these compounds
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82bb128c45b8d7d7e76c888ac7ca1091
https://doi.org/10.1016/j.ijadhadh.2012.08.006
https://doi.org/10.1016/j.ijadhadh.2012.08.006
Publikováno v:
Microelectronics Reliability. 52:1711-1718
In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. Du
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5521561293d1aef632f4c406b952bc6
https://doi.org/10.1016/j.microrel.2012.03.025
https://doi.org/10.1016/j.microrel.2012.03.025
Publikováno v:
International Journal of Adhesion and Adhesives. 32:82-88
Semi-conductor devices are mostly encapsulated by epoxy molding compound (EMC) materials. During encapsulation stresses are generated due to the curing of the molding compound. Moreover, additional stresses will build up during cooling down from mold
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf36a9f1ffa198ff96335f24c4de6552
https://doi.org/10.1016/j.ijadhadh.2011.10.007
https://doi.org/10.1016/j.ijadhadh.2011.10.007
Publikováno v:
The Journal of Adhesion. 86:561-585
Charpy impact tests were conducted on repaired notched aluminum specimens and the absorbed energy and fracture behavior of the specimens were investigated. The aluminum specimens contained a single-edge notch and were repaired with a metal sheet, com
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3779592ad32517185bcbc40f3d99dd88
https://doi.org/10.1080/00218464.2010.484310
https://doi.org/10.1080/00218464.2010.484310
Akademický článek
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Publikováno v:
Composite Structures. 89:270-274
In this study, edge-cracked aluminum plates repaired with one-sided composite patches were investigated experimentally for their response to Charpy impact test. Two different materials were used for composite patches, in one the reinforcement was wov
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45c0b2b54a4e2ee42649ec14246d371e
https://doi.org/10.1016/j.compstruct.2008.07.032
https://doi.org/10.1016/j.compstruct.2008.07.032
Akademický článek
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