Zobrazeno 1 - 5
of 5
pro vyhledávání: '"M. S. Rusdi"'
Autor:
M. S. Rusdi, Azman Jalar, P. Rethinasamy, M. Z. Abdullah, M. S. Abdul Aziz, M. H. H. Ishak, Muhammad Khalil Abdullah
Publikováno v:
The International Journal of Advanced Manufacturing Technology. 108:3351-3359
The first step in the surface mount technology is the printing of the solder paste. The amount of solder placed on the cooper pad is important in guaranteeing an acceptable quality of soldering. Experimental works and studies for this process consume
Autor:
Mohd Sharizal Abdul Aziz, I. N. Sahrudin, M. S. Rusdi, M. H. H. Ishak, C. Y. Khor, Mohd Arif Anuar Mohd Salleh
Publikováno v:
Recent Progress in Lead-Free Solder Technology ISBN: 9783030934408
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c97d171226be4347eb11cc5760322f20
https://doi.org/10.1007/978-3-030-93441-5_4
https://doi.org/10.1007/978-3-030-93441-5_4
Publikováno v:
Recent Progress in Lead-Free Solder Technology ISBN: 9783030934408
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0010afd1418a10d033e619c71749734f
https://doi.org/10.1007/978-3-030-93441-5_14
https://doi.org/10.1007/978-3-030-93441-5_14
Autor:
M. Z. Abdullah, M. H. H. Ishak, M. S. Abdul Aziz, P. Rethinasamy, M. S. Rusdi, Muhammad Khalil Abdullah
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 852:012084
The present work studied on the volume reduction and cold slump effect for lead-free solder. The solder paste SAC305 type 3 was used to study the effect of waiting time on the solder volume and height at room temperature. DEK 265 was used for the pri
Autor:
M. S. Rusdi, M.H.S. Abd Samad, Muhammad Khalil Abdullah, P. Rethinasamy, C. Y. Khor, A.A. Bakar, Mohd Zulkifly Abdullah, M. S. Abdul Aziz, Sivakumar Veerasamy
Publikováno v:
Journal of Physics: Conference Series. 1082:012057
The high requirement of smaller size, lighter weight, and high performance Printed Circuit Board (PCB) in electronic packaging has contributed to the wide application of stencil printing for soldering process. However, during stencil printing stage c