Zobrazeno 1 - 5
of 5
pro vyhledávání: '"M. Renez"'
Publikováno v:
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th, 2005, Singapore, Singapore. Volume: 2, On page(s): 5 pp.-, ⟨10.1109/EPTC.2005.1614459⟩
Scopus-Elsevier
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th, 2005, Singapore, Singapore. Volume: 2, On page(s): 5 pp.-, ⟨10.1109/EPTC.2005.1614459⟩
Scopus-Elsevier
ISBN: 0-7803-9578-6; Various aspects of the dynamic thermal modelling of multiple die packages are discussed in the paper. After a short literature review of the subject the structure function based thermal modelling is presented briefly with an exam
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e59c5c0b3077a425c79cd0dffe4e9d30
https://hal.archives-ouvertes.fr/hal-00079216
https://hal.archives-ouvertes.fr/hal-00079216
Publikováno v:
Mixed-Signal Design, 1999. SSMSD '99. 1999 Southwest Symposium on
The paper presents tools and methods for the simulation, testing and modeling of the thermal behavior and electro-thermal interactions in ICs, MCMs and PWBs. Examples demonstrate the usability of the methods.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d4c18eccffecb10447acf8fd4c0c0ba7
https://hal.archives-ouvertes.fr/hal-00007880
https://hal.archives-ouvertes.fr/hal-00007880
Conference
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Autor:
Kollar, E.
Publikováno v:
26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials Production, 2003; 2003, p133-136, 4p
Autor:
Garcia, E.A.
Publikováno v:
Nineteenth Annual IEEE Semiconductor Thermal Measurement & Management Symposium, 2003; 2003, p160-167, 8p