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pro vyhledávání: '"M. Renavikar"'
Akademický článek
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Akademický článek
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Autor:
M. Renavikar, Taylor Rawlings, Diglio Paul J, Paresh Daharwal, Mohit Khurana, George Hsieh, Pooya Tadayon, Nilesh Badwe, Sarah Wozny
Publikováno v:
Materialia. 18:101136
Nanocrystalline (nc) alloys, owing to their high strength, have been extensively studied over the past few years. High-temperature mechanical properties including tensile and fatigue were studied for commercially obtained nc nickel-cobalt-phosphorous
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe32cca939fc90b5b6ae3d207b3141dd
https://doi.org/10.1016/j.mtla.2021.101136
https://doi.org/10.1016/j.mtla.2021.101136
Autor:
Shubhada H. Sahasrabudhe, Scott Mokler, Owen Jin, Nilesh Badwe, Pubudu Goonetilleke, Eric Brigham, Kevin Byrd, Satish Parupalli, Sandeep B. Sane, M. Renavikar
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Intel's commitment to the environment continues with a breakthrough technology – Low Temperature Solder for Surface Mounted Devices. In this paper we will introduce the technology and its benefits to PC and electronic device manufacturers. We will
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2bfc9d5842152a69dff95d767963e05a
https://doi.org/10.1109/ectc.2018.00222
https://doi.org/10.1109/ectc.2018.00222
Publikováno v:
Journal of Electronic Materials. 43:4485-4496
When dropped, electronic packages often undergo failure by propagation of an interfacial crack in solder joints under a combination of tensile and shear loading. Hence, it is crucial to understand and predict the fracture behavior of solder joints un
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::695db3cb5dee6fa7ea5e7d70bf109693
https://doi.org/10.1007/s11664-014-3441-6
https://doi.org/10.1007/s11664-014-3441-6
Autor:
Ravi Mahajan, Indranath Dutta, Uttara Sahaym, M. Renavikar, Jia Liu, Rishi Raj, Rajen S. Sidhu
Publikováno v:
Journal of Materials Science. 49:7844-7854
Cu particle-containing In-matrix composites for thermal interface material (TIM) applications were prepared via liquid phase sintering, following chemical modification of the Cu–In interfaces. The optimized composite TIM possessed 1.5 times the the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::be8d86b03be4c4329afa08283aee11f4
https://doi.org/10.1007/s10853-014-8495-6
https://doi.org/10.1007/s10853-014-8495-6
Publikováno v:
Journal of Electronic Materials. 41:412-424
A methodology to construct fracture mechanism maps for Sn-3.8%Ag-0.7%Cu (SAC387) solder joints attached to Cu substrates has been developed. The map, which delineates the operative mechanisms of fracture along with corresponding joint fracture toughn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa6b39befc3af7f8d105e3997f450209
https://doi.org/10.1007/s11664-011-1806-7
https://doi.org/10.1007/s11664-011-1806-7
Publikováno v:
Journal of Materials Science. 46:7012-7025
This study reports on the processing and characterization of composite solders produced by liquid phase sintering, which comprise a high-melting phase such as Cu embedded in a matrix of a low-melting phase such as In. These solders combine higher ele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f4ae252c0a0adf6761c1542ed8532be
https://doi.org/10.1007/s10853-011-5670-x
https://doi.org/10.1007/s10853-011-5670-x
Publikováno v:
Journal of Electronic Materials. 38:2735-2745
Because of their very high thermal conductivity, low melting point, and high shear compliance, indium-based materials are excellent candidates for thermal interface material (TIM) applications for packaging thermally sensitive next-generation devices
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b002fedf4b4e51cf8362c34e65d6e1b4
https://doi.org/10.1007/s11664-009-0898-9
https://doi.org/10.1007/s11664-009-0898-9
Publikováno v:
Journal of Electronic Materials. 35:2088-2097
Sn-rich solders have been shown to have superior mechanical properties when compared to the Pb-Sn system. Much work remains to be done in developing these materials for electronic packaging. In this paper, we report on the microstructure and mechanic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::baf846c45cbb95d18aa2b061b2804f18
https://doi.org/10.1007/s11664-006-0318-3
https://doi.org/10.1007/s11664-006-0318-3