Zobrazeno 1 - 2
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pro vyhledávání: '"M. R. Turgeon"'
Autor:
David Danovitch, G. P. Brouillete, M. R. Turgeon, Valerie Oberson, Peter A. Gruber, Jean-Luc Landreville, D. T. Naugle, Luc Belanger, Da-Yuan Shih, Christopher L. Tessler
Publikováno v:
IBM Journal of Research and Development. 49:621-639
As the demand for flip-chip interconnects mounts across an increasingly large spectrum of products and technologies, several wafer-bumping proeesses have been developed to produce the small solder features required for this interconnect technology. T
Autor:
Valerie Oberson, Da-Yuan Shih, M. R. Turgeon, H. Kimura, Guy Paul Brouillette, David Danovitch, Luc Belanger, Peter A. Gruber
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
A new wafer bumping technology is described that is especially suited for Pb-free applications. Although capable of using standard PbSn eutectic solder, IMS (injection molded solder) has been found to be especially suited for accommodating a wide ran