Zobrazeno 1 - 3
of 3
pro vyhledávání: '"M. R. Tuck"'
Publikováno v:
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95).
The peak thermal power generated in microelectronics assemblies has risen from less than 1 W/cm/sup 2/ in 1980 to greater than 40 W/cm/sup 2/ today, due primarily to increasing densities at both the IC and packaging levels. We have demonstrated enhan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::24c4561468f193906b1bc9e5b210326c
https://doi.org/10.1109/mcmc.1995.512025
https://doi.org/10.1109/mcmc.1995.512025
Autor:
Jay Kunze, George D. Pincock, Robert Hyland, John K. Long, J. A. Redfield, J. H. Murphy, R. W. Hyndman, M. R. Tuck, John E. Foley, Robert L. Seale, E. L. Carls, N. M. Levitz, D. Grosvenor, W. Murphy, D. Raue, G. J. Vogel, B. Kullen, S. D. Stoddard, D. E. Nuckolls, Joseph S. Cheka, Klaus Becker, E. A. Straker, Peter Vilinskas, Robert J. Schiltz
Publikováno v:
Nuclear Applications. 2:201-204
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::77095b5be94986749ae6489b39c997ed
https://doi.org/10.13182/nt66-a27587
https://doi.org/10.13182/nt66-a27587
Autor:
M. R. Tuck, R. W. Hyndman
Publikováno v:
Nuclear Applications. 6:137-141
An on-line digital data reduction method has been adopted at Experimental Breeder Reactor II for transfer function analyses of reactor stability. Adoption of this system has decreased the time requ...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::335b6a0b4c264f9cfc1f5eb4caf00def
https://doi.org/10.13182/nt69-a28244
https://doi.org/10.13182/nt69-a28244