Zobrazeno 1 - 1
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pro vyhledávání: '"M. R. Benzidane"'
Publikováno v:
Electrical engineering & Electromechanics, Vol 2023, Iss 6, Pp 54-57 (2023)
Introduction. Through-silicon-via (TSV) is one of the most important components of 3D integrated circuits. Similar to two-dimensional circuits, the performance evaluation of 3D circuits depends on both the quality factor and inductance. Therefore, ac
Externí odkaz:
https://doaj.org/article/e5728be9163e4bdebdf9c88d81d5e5e1
