Zobrazeno 1 - 10
of 27
pro vyhledávání: '"M. Olszacki"'
Autor:
M. Olszacki, Isabella Augustyniak, Émilie Debourg, P. Knapkiewicz, Patrick Pons, K. Sareło, Jan Dziuban
Publikováno v:
Sensors and Actuators A: Physical
Sensors and Actuators A: Physical, 2015, 232, pp. 353-358. ⟨10.1016/j.sna.2015.05.006⟩
Sensors and Actuators A: Physical, Elsevier, 2015, 232, pp. 353-358. ⟨10.1016/j.sna.2015.05.006⟩
Sensors and Actuators A: Physical, 2015, 232, pp. 353-358. ⟨10.1016/j.sna.2015.05.006⟩
Sensors and Actuators A: Physical, Elsevier, 2015, 232, pp. 353-358. ⟨10.1016/j.sna.2015.05.006⟩
International audience; The silicon-glass MEMS high dose radiation sensor with the optical read-out, acting above 10 kGy has been presented. The sensor consists of a microchamber filled with small portion of high density polyethy-lene (HDPE) and thin
Micromechanical High-doses Radiation Sensor with Bossed Membrane and Interferometry Optical Read-out
Autor:
Émilie Debourg, K. Sareło, I. Augustyniak, P. Knapkiewicz, Patrick Pons, Jan Dziuban, M. Olszacki
Publikováno v:
Proceedings Eurosensors
Eurosensors XXVIII
Eurosensors XXVIII, Sep 2014, Brescia, Italy. pp.Proceedings Eurosensors
Eurosensors XXVIII
Eurosensors XXVIII, Sep 2014, Brescia, Italy. pp.Proceedings Eurosensors
International audience; The silicon-glass MEMS high-doses radiation sensor with in situ detection, so far not possible in the field of detection of doses above 10 kGy, has been presented. The sensor consists of a chamber filled with the high density
Autor:
M. Matusiak, J. Philippe, Hervé Aubert, P. Knapkiewicz, Jan Dziuban, I. Augustyniak, M. Olszacki, Patrick Pons, E. Debourg
Publikováno v:
Proceedings IEEE Sensors
IEEE Sensors
IEEE Sensors, Oct 2016, Orlando, United States
IEEE Sensors
IEEE Sensors, Oct 2016, Orlando, United States
International audience; This communication reports the very first experimental results on an original wireless, chipless and passive (battery-less) sensor for monitoring high doses of nuclear radiation. The micro-sensor combines a miniature hydrogen
Publikováno v:
Procedia Chemistry. 1:44-47
Absolute piezoresistive pressure sensors often use direct wafer bonding of SOI with the etched bulk silicon to provide us with sensitive membranes and sealed cavities. The advantage of such a process is that we can easily obtain a thin, monocrystalli
Publikováno v:
Procedia Chemistry. 1(1):429-432
The thermal treatment during the fabrication process may induce some undesirable phenomena. In case of membrane-based actuators fabricated with wafer-bonding technology, a residual stress may appear within the membrane, which may cause an initial def
Autor:
Jan Dziuban, M. Matusiak, Patrick Pons, M. Olszacki, Hervé Aubert, A. Rifai, Émilie Debourg, I. Augustyniak, P. Knapkiewicz
Publikováno v:
European Microwave Week (EuMW)
European Microwave Week (EuMW), Sep 2015, Paris, France
European Microwave Week (EuMW), Sep 2015, Paris, France
International audience; This communication reports the last results obtained on the development of a wireless passive chipless sensor for high doses radiation monitoring. The sensor is based on polymer out-gazing inside a micro-chamber coupled with e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5e239d727c3d7f73aa50102be4ef5d30
https://hal.science/hal-01237524
https://hal.science/hal-01237524
Autor:
Émilie Debourg, I. Augustyniak, Jan Dziuban, M. Matusiak, Patrick Pons, A. Rifai, M. Olszacki, Hervé Aubert, P. Knapkiewicz, Denis Lavielle, C. Chatry
Publikováno v:
IEEE SENSORS 2014 Proceedings.
The high dose measurement techniques are of the great interest in nuclear engineering for both, industrial and academic community. Related to these very harsh environment, today sensors solutions are based on external post analysis that not allow rea
Publikováno v:
Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Publikováno v:
Proceedings Transducers
Transducers
Transducers, Jun 2013, Barcelone, Spain. pp.T4A.005
Transducers
Transducers, Jun 2013, Barcelone, Spain. pp.T4A.005
International audience; New MEMS sensor for detection of high doses (above 10 kGy) of radiation has been presented. The sensor is made of silicon and glass in a form of anodically bonded sandwich 9 × 16 × 2.6 mm3. The sensor contains chamber with s
Publikováno v:
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
In the design process, modelling is a fundamental stage which allows the designer to obtain a general overview of the device performance. Very often, this phase is very time-consuming, especially if a welloptimized device which fulfils very specific