Zobrazeno 1 - 10
of 22
pro vyhledávání: '"M. M. Sabry"'
Autor:
Karim, Montasser, Heba Ahmed, Osman, Hanan, Abozaid, Haidy S, Khalil, Wesam, Hatem Amer, Abeer M M, Sabry
Publikováno v:
Medicine. 101:e31022
Multiplex PCR is a sensitive and rapid method compared with conventional methods. Therefore, we use multiplex PCR for the rapid detection of the four major intestinal pathogens causing gastroenteritis (Shigella spp., Campylobacter spp., Aeromonas spp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1ef4c45c62122c84204ae8dfcbabd4da
https://doi.org/10.1097/md.0000000000031022
https://doi.org/10.1097/md.0000000000031022
Publikováno v:
Comparative Exercise Physiology. 13:45-52
The effects of interleukin-6 (IL-6), a growth promoting myokine through signal transduction, and activator of transcription 3 (STAT3), as a growth promoting signal, in peripheral nerve injury (PNI) are still unclear, including whether exercise pre- a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e337acac4d419742f148ae580facaed5
https://doi.org/10.3920/cep160028
https://doi.org/10.3920/cep160028
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 30:1883-1896
3-D stacked systems reduce communication delay in multiprocessor system-on-chips (MPSoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates temperature-induced proble
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85fe1f556c3e99fce9e5fcc18a1f7263
https://doi.org/10.1109/tcad.2011.2164540
https://doi.org/10.1109/tcad.2011.2164540
Publikováno v:
IEEE Embedded Systems Letters
The development of compiler-based mechanisms to optimize the thermal profile of large register files to improve the processor reliability has become an important issue. Thermal hotspots have been known to cause severe reliability issues, while the th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a824b77f0f3689c4728572d6b8ee00eb
https://doi.org/10.1109/les.2010.2081343
https://doi.org/10.1109/les.2010.2081343
Publikováno v:
CARS 2002 Computer Assisted Radiology and Surgery ISBN: 9783642628443
We present a new method for 3-D volume segmentation of the human cerebrovascular structures from Magnetic Resonance Angiograms (MRA) and Magnetic Resonance Ventriculargrams (MRV). A slice through the volume containing large vein or artery structures
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d37b3d3e92643521419acd4309e3205
https://doi.org/10.1007/978-3-642-56168-9_63
https://doi.org/10.1007/978-3-642-56168-9_63
Publikováno v:
Egyptian Poultry Science Journal; 2015, Vol. 35 Issue 3, p647-672, 26p
Publikováno v:
Archiv fur experimentelle Veterinarmedizin. 43(2)
In 7 normal healthy Egyptian one-humped camels aged 3-4 years, the relationships were studied between enzyme activities of lactic dehydrogenase (LDH), creatine phosphokinase (CPK), alkaline phosphatase (ALP), acid phosphatase (ACP), and cholonesteras
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::a337e5492a1b04d4b404050a84d40680
https://pubmed.ncbi.nlm.nih.gov/2774821
https://pubmed.ncbi.nlm.nih.gov/2774821
Recent advances in process technology augment the systems-on-chip (SoCs) functionality per unit area with the substantial decrease of device features. However, features abatement triggers new reliability issues such as the single-event multi-bit upse
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6feef23fe00c21f82b83b71083af9425
https://infoscience.epfl.ch/record/173477
https://infoscience.epfl.ch/record/173477
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Liquid cooling using interlayer microchannels has appeared as a viable and scalable packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel-based liquid cooling, however, can substantially increase the on-chip thermal gradi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fcdce226a5773c986363a0ff2aa3a4f7
https://infoscience.epfl.ch/record/186491
https://infoscience.epfl.ch/record/186491
While possessing the potential to replace conventional air-cooled heat sinks, inter-tier microchannel liquid cooling of 3D ICs also creates the problem of increased thermal gradients from the fluid inlet to outlet ports [1, 2]. These cooling-induced
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::22d4e350a8cb6e23dfe4889209e9ad16
https://infoscience.epfl.ch/record/173478
https://infoscience.epfl.ch/record/173478