Zobrazeno 1 - 10
of 44
pro vyhledávání: '"M. Lousberg"'
Autor:
Helen Yang, Haijin Zhu, Marco M. R. M. Hendrix, Niek J. H. G. M. Lousberg, Gijsbertus de With, A. Catarina C. Esteves, John H. Xin
Publikováno v:
Advanced Materials, 25(8), 1150-1154. Wiley-VCH Verlag
A sponge-like cotton fabric autonomously collects and releases water from fogs triggered by typical day-and-night temperature variations. The reversible switching between absorbing-superhydrophilic/releasing-superhydrophobic states results from struc
Autor:
Jeroen A. C. M. Goos, Cong D. Vo, Archan Dey, Chris J. van den Hoogen, Niek J. H. G. M. Lousberg, Marco M. R. M. Hendrix, Nicola Tirelli, Gijsbertus de With, Nico Sommerdijk
Publikováno v:
Zeitschrift für Kristallographie, 227, 739-743. Oldenbourg
The synthesis of a new class of hybrid materials with two differently oriented layers of calcite at adjacent sides of an organic template is demonstrated. A Langmuir monolayer of the amphiphilic block copolymer poly(butyl acrylate)-b-poly(hydroxyprop
Publikováno v:
Journal of Electronic Testing. 19:369-376
The ability to achieve and maintain high yield levels is directly dependent on the capability to detect and analyze repetitive failure mechanisms. In this paper, an advanced statistical diagnosis method, using the final wafer test results, is present
Autor:
Erik Jan Marinissen, M. Lousberg, Rohit Kapur, Mike Ricchetti, Yervant Zorian, Teresa McLaurin
Publikováno v:
Journal of Electronic Testing. 18:365-383
The increased usage of embedded pre-designed reusable cores necessitates a core-based test strategy, in which cores are tested as separate entities. IEEE P1500 Standard for Embedded Core Test (SECT) is a standard-under-development that aims at improv
Autor:
M. Lousberg, Joan Figueras, A.K. Maihi, D. Arumi, Rosa Rodriguez-Montanes, C. Hora, S. Eichenberger, B. Kruseman
Publikováno v:
VTS
Improvement of diagnosis methodologies is a key factor for fast failure analysis and yield improvement. As bridging defects are a common defect type in CMOS circuits, diagnosing this class of defect becomes relevant for present and future technologie
Autor:
S. Einchenberger, Rosa Rodriguez-Montanes, M. Lousberg, B. Kruseman, Ananta K. Majhi, D. Arumi, Joan Figueras, C. Hora
Publikováno v:
UPCommons. Portal del coneixement obert de la UPC
Universitat Politècnica de Catalunya (UPC)
Recercat. Dipósit de la Recerca de Catalunya
instname
VTS
Universitat Politècnica de Catalunya (UPC)
Recercat. Dipósit de la Recerca de Catalunya
instname
VTS
Best Paper Award al millor article del congrés IEEE VLSI Test Symposium 2007 A proposal for enhancing the diagnosis of full open defects in interconnecting lines of CMOS circuits is presented. The defective line is first classified as fully opened b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::20761a1ce3293ab8fcd1089faca1d932
http://hdl.handle.net/2117/7733
http://hdl.handle.net/2117/7733
Publikováno v:
Proceedings of the 31st European Solid-State Circuits Conference, 2005. ESSCIRC 2005..
This paper presents the effectiveness of various stress conditions (mainly voltage and frequency) on detecting the resistive shorts and open defects in deep sub-micron embedded memories in an industrial environment. Simulation studies on very-low vol
Publikováno v:
Proceedings 17th IEEE VLSI Test Symposium (Cat. No.PR00146).
Publikováno v:
VTS
Resistive bridges not only cause a static faulty behavior in CMOS memories, but also lead to several dynamic faulty behaviors which are timing related failures. This paper introduces a new realistic dynamic fault model for random access-memories: the
Publikováno v:
DATE
This paper presents the effectiveness of various stress conditions (mainly voltage and frequency) on detecting the resistive shorts and open defects in deep sub-micron embedded memories in an industrial environment. Simulation studies on very-low vol