Zobrazeno 1 - 10
of 31
pro vyhledávání: '"M. Liebens"'
Autor:
M. Liebensteiner, A. Keiler, R. El Attal, P. Balcarek, F. Dirisamer, J. Giesinger, G. Seitlinger, M. Nelitz, A. Keshmiri, J. Frings, Ch. Becher, P. Kappel, D. Wagner, G. Pagenstert
Publikováno v:
Journal of Orthopaedic Surgery and Research, Vol 16, Iss 1, Pp 1-8 (2021)
Abstract Background Patellar instability has a high incidence and occurs particularly in young and female patients. If the patella dislocates for the first time, treatment is usually conservative. However, this cautious approach carries the risk of r
Externí odkaz:
https://doaj.org/article/744df6f3ae354806bccb98e55c43b6cd
Autor:
Michael Kotelyanskii, T. Kryman, M. Mehendale, Jaber Derakhshandeh, P. Mukundhan, Andy Miller, R. Mair, M. Liebens, Lin Hou, Eric Beyne
Publikováno v:
International Symposium on Microelectronics. 2019:000274-000279
The constant demand for small-feature-size, high performance and dense I/O applications have necessitated the development of fine-pitch vertical interconnects for 3-D integration. Microbumps and through silicon vias enable the high-density vertical i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de625737306dec41e1361a6c4859a4db
https://doi.org/10.4071/2380-4505-2019.1.000274
https://doi.org/10.4071/2380-4505-2019.1.000274
Autor:
Samuel Suhard, Koen Kennes, Gerald Beyer, M. Liebens, Pieter Bex, Alain Phommahaxay, Eric Beyne, Andy Miller, Ferenc Fodor, John Slabbekoorn
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In this paper, a collective hybrid bonding of a die to wafer is demonstrated. The key integration steps such as CMP, wet etch, cleaning, defect metrology, alignment optimization in die to wafer and wafer to wafer bonding tools are discussed in detail
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38b1e70493a6b30dfd70a0406c015e46
https://doi.org/10.1109/ectc32862.2020.00208
https://doi.org/10.1109/ectc32862.2020.00208
Autor:
S. Hiebert, M. Liebens, T. Krah, John Slabbekoorn, A. Vangal, R. Yeoh, Eric Beyne, Andy Miller, Andrew Cross
Publikováno v:
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Advanced wafer level packaging is moving into high volume mobile and consumer electronics markets. Drivers for new packaging and integration schemes are lower-cost processes and the high count of interconnects. The different functional parts of a hig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::caa6dbd5efe95add69f462d9db1038eb
https://doi.org/10.1109/asmc.2019.8791791
https://doi.org/10.1109/asmc.2019.8791791
Autor:
Andy Miller, John Slabbekoorn, Andrew Cross, M. Liebens, M. Stoerring, S. Hiebert, Eric Beyne
Publikováno v:
2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Over the last years, 3D TSV technology and 3D stacking have moved into the preproduction and yield ramp phase. The characterization of many of the different critical modules within the 3D stacking integration flows is becoming more and more crucial.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40c12b22f2d53b34fc90e310ec8cca86
https://doi.org/10.1109/asmc.2018.8373210
https://doi.org/10.1109/asmc.2018.8373210
Autor:
Andrew Cross, M. Stoerring, T. Vandeweyer, S. Hiebert, Shifang Li, J. De Vos, Andy Miller, G. Bast, Anne Jourdain, M. Liebens, Eric Beyne
Publikováno v:
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Device packaging techniques continue to evolve. Modern packages connect components directly using different 3-D interconnect technologies. As the 3-D interconnect density is increasing exponentially, pitches need to reduce. Current interconnect techn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4fe01ca545db4bd35b3f6278007edae3
https://doi.org/10.1109/asmc.2017.7969255
https://doi.org/10.1109/asmc.2017.7969255
Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
In this paper we will described an integrated wet process for bump fabrication. The integrated wet process is comprising of a photoresist strip, a copper (Cu) seed layer etch and a titanium-tungsten alloy (TiW) etch. In order to minimize the Cu later
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9cf8d9cf855bb19b44f46e791750c223
https://doi.org/10.1109/eptc.2016.7861453
https://doi.org/10.1109/eptc.2016.7861453
Autor:
Eric Beyne, Priya Mukundhan, M. Liebens, Andy Miller, Manjusha Mehendale, Michael Kotelyanskii, X. Ru, Todd W. Murray, Robin Mair, S. Van Huylenbroeck, T. Kryman, L. Haensel
Publikováno v:
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Through Silicon Via (TSV) technology represents one key aspect of 3D integration. International Technology Roadmap for Semiconductors (ITRS) has identified a need for an in-line metrology for characterizing voids in TSV structures. We have previously
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90c93630e97603f35833d623ce9eb482
https://doi.org/10.1109/asmc.2016.7491103
https://doi.org/10.1109/asmc.2016.7491103
Publikováno v:
MFI
This paper presents a new approach to the problem of image-based tracking of multiple persons in a heavy occluded space using a single camera. The presence of heavy occlusions results in uncertain measurement data. Examples of heavy occlusions are ob
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::754386e435aa3a844b05175d77ebae9d
https://doi.org/10.1109/mfi.2006.265635
https://doi.org/10.1109/mfi.2006.265635
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