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pro vyhledávání: '"M. Lemkin"'
Autor:
M. Lemkin
Publikováno v:
IEEE Journal of Solid-State Circuits. 38:1730-1734
A 200-V high-voltage amplifier with a 50-kHz bandwidth is built in a 10-V trench-isolated CMOS process with complementary high-voltage transistors. The high-voltage amplifier uses parasitic field-oxide transistors to dc stabilize the input-output vol
Autor:
M. Lemkin, Bernhard E. Boser
Publikováno v:
IEEE Journal of Solid-State Circuits. 34:456-468
This paper describes a three-axis accelerometer implemented in a surface-micromachining technology with integrated CMOS. The accelerometer measures changes in a capacitive half-bridge to detect deflections of a proof mass, which result from accelerat
Publikováno v:
Proceedings of 1995 American Control Conference - ACC'95.
It is often necessary to estimate the velocity of mechanical systems from the output of a digital encoder. Due to cost and/or noise problems, there maybe no direct velocity measurement available on such systems. Velocity reversal and sparseness of en
Publikováno v:
Proceedings of 1995 American Control Conference - ACC'95.
This paper discusses a low cost solution to teaching controls in the laboratory through the use of a novel balance beam. The balance beam provides a vehicle to address many problems of control implementation as well as control algorithms. Due to the
Autor:
C.S. Gormley, A. Brogan, T.J. Brosnihan, S.J. Sherman, N.A. Polce, S.A. Brown, D.J. Collins, M. Lemkin, M.S. Davis
Publikováno v:
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).
The ability of silicon micromachining to produce small, precision, movable parts provides an opportunity for MEMS component use in optical communications networks. To address this potential market, Analog Devices has developed the Optical iMEMS/sup /
Autor:
M. Lemkin, Bernhard E. Boser
Publikováno v:
Proceedings of Custom Integrated Circuits Conference.
A monolithic surface micromachined lateral accelerometer with on-chip A/D converter is described. The device features a fully differential capacitive interface between the sensing element and on-chip electronics to minimize the systematic offset and
Publikováno v:
1997 IEEE International Solids-State Circuits Conference. Digest of Technical Papers.
A monolithic 3-axis surface micromachined accelerometer with capacitive sense and feedback circuitry uses three separate proof masses to measure acceleration. Each proof mass has its own set of interface circuitry, all of which are coordinated by an
Publikováno v:
Proceedings ISSCC '95 - International Solid-State Circuits Conference.
A surface micromachined accelerometer with on-chip electronics realized in a 3 /spl mu/m BiCMOS technology is described. The sensing element consists of a thin film of polysilicon that is deposited after fabrication of the electronic circuitry. Accel
Periodical
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