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Publikováno v:
Technical Digest. Summaries of papers presented at the Conference on Lasers and Electro-Optics. Postconference Edition. CLEO '99. Conference on Lasers and Electro-Optics (IEEE Cat. No.99CH37013).
Summary form only given. Direct wafer bonding is an attractive technique for the heterogeneous integration of dissimilar materials, including III-V and silicon-on-insulator structures (SOI). Recently a novel technique (crystal ion slicing) has been r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1373bd0420dedcd423c1b4ec00ed5cb0
https://doi.org/10.1109/cleo.1999.834500
https://doi.org/10.1109/cleo.1999.834500
