Zobrazeno 1 - 10
of 27
pro vyhledávání: '"M. Le Helley"'
Publikováno v:
Proceedings Euro ASIC '92.
The authors present SETIPIC, a software to simulate the electrothermal interactions in the first design steps of power integrated circuits. To give a well-consistent interface to the designer, SETIPIC has been integrated in the EDGE CAD system. The s
Publikováno v:
[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
The authors present SETIPIC, a software package which couples electric and thermal simulations to forecast the electrothermal interactions in the first design steps of power integrated circuits. To give a consistent interface to the designer, SETIPIC
Publikováno v:
[1992] Proceedings The European Conference on Design Automation.
Presents SETIPIC, a software package to forecast the electrothermal interactions in the first design steps of power integrated circuits. To give a well-consistent interface with graphic tools to the designer, SETIPIC works under the EDGE CAD system.
Publikováno v:
Proceedings Euro ASIC '92.
The authors present CLAP, a program for automatic layout generation of a cascode current source. The source is considered as a parameterized macrocell whose parameters are either the dimensions of the transistors or the values of the expected current
Publikováno v:
PDP
In order to achieve more accurate studies, there is a definite trend towards 3D numerical simulations, which require very long computation times. We report on a parallel architecture multiprocessor system dedicated to the resolution of 3D partial dif
Publikováno v:
[Proceedings] EURO ASIC `90.
A hardware solver for Delta Psi =f( Psi ), by the finite-difference method in 3D is presented. The general architecture is given: several identical processors run in a parallel mode in a PC-type environment. Each processor is a specific circuit (ASIC
Publikováno v:
COM.P.EL.98. Record 6th Workshop on Computer in Power Electronics (Cat. No.98TH8358).
The paper describes the results of common works of the Technical University of Lodz (TUL) and the Ecole Centrale de Lyon (ECL) to give the software for 3D simulation of sophisticated thermal problems in electronic equipment. Both the programs, one of
Publikováno v:
Euro ASIC '91.
To take advantage of microelectronics, attempts have been made to integrate sensors in silicon and furthermore to accommodate the whole system formed of the sensor and its signal processing circuit. The major problem is the compatibility between both
Publikováno v:
Euro ASIC '91.
In this paper authors present a new approach to fast CMOS opamp design. This approach benefits from the advantages offered by full complementary implementations of well known subcircuits, to enhance the speed of such an operational amplifier and to b
Publikováno v:
EURO ASIC `90
EURO ASIC `90, May 1990, Paris, France. pp.86-88, ⟨10.1109/EASIC.1990.207915⟩
EURO ASIC `90, May 1990, Paris, France. pp.86-88, ⟨10.1109/EASIC.1990.207915⟩
International audience; Presents a set of tools for aiding to the design of analog CMOS circuits. The procedures described can generate automatically the layout of CMOS cells. In addition to the electrical parameters of each component, transistor, re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8106106720aa18edecc67f7f46889541
https://hal.archives-ouvertes.fr/hal-03376248
https://hal.archives-ouvertes.fr/hal-03376248