Zobrazeno 1 - 10
of 22
pro vyhledávání: '"M. K. Neilsen"'
Publikováno v:
Volume 2A: Advanced Manufacturing.
Ceramic to metal brazing is a common bonding process used in many advanced systems such as automotive engines, aircraft engines, and electronics. In this study, we use optimization techniques and finite element analysis utilizing viscoplastic and the
Autor:
Victoria Brinnel, Sheng Wei Chi, Scott Edward Sanborn, Benedikt Döbereiner, Tiantian Zhang, P. D Mattie, Junhe Lian, X. J. Fang, Matthieu Mazière, Ashkan Mahdavi, Thomas Bosiljevac, Napat Vajragupta, Michael Veilleux, Sylvia Feld-Payet, Tomasz Wierzbicki, James E. Warner, John A. Moore, Bruce W. Williams, Keunhwan Pack, Khalil I. Elkhodary, James W. Foulk, Jim Lua, Denis Novokshanov, Arthur A. Brown, Brad L. Boyce, Sharlotte Kramer, Vladislav A. Yastrebov, Krishnaswamy Ravi-Chandar, Yidu Di, Bo Wu, John L. Bignell, A. R. Cerrone, Anthony R. Ingraffea, Aida Nonn, Jožef Predan, G.F. Bomarito, Kyle N. Karlson, B.J. Carter, Pawel Kucharczyk, Edmundo Corona, Sebastian Münstermann, Jacob D. Hochhalter, Shih-Po Lin, M. K. Neilsen, Derek H. Warner, Kristin Dion, J. Zadravec, Jacques Besson, C. H M Simha, Christopher Andrew Jones, Vincent Chiaruttini, Jean-Louis Chaboche, Liang Xue, Andrew J. Gross
Publikováno v:
International Journal of Fracture
International Journal of Fracture, Springer Verlag, 2016, 198, pp.5-100. ⟨10.1007/s10704-016-0089-7⟩
Springer Netherlands
International journal of fracture 198(1), 5-100 (2016). doi:10.1007/s10704-016-0089-7 special issue: "Special Issue: Sandia Fracture Challenge 2014 / Guest Edited by Sharlotte L.B. Kramer"
International Journal of Fracture, Springer Verlag, 2016, 198, pp.5-100. ⟨10.1007/s10704-016-0089-7⟩
Springer Netherlands
International journal of fracture 198(1), 5-100 (2016). doi:10.1007/s10704-016-0089-7 special issue: "Special Issue: Sandia Fracture Challenge 2014 / Guest Edited by Sharlotte L.B. Kramer"
Ductile failure of structural metals is relevant to a wide range of engineering scenarios. Computational methods are employed to anticipate the critical conditions of failure, yet they sometimes provide inaccurate and misleading predictions. Challeng
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::49c56b3af3684d14483d2ec47bf61983
Publikováno v:
Journal of Electronic Packaging. 128:71-81
This paper summarizes the results of a program to construct an internal variable viscoplastic damage model to characterize 95.5Sn–3.9Ag–0.6Cu (wt.%) lead-free solder under cyclic thermomechanical loading conditions. A unified model is enhanced to
Publikováno v:
International Journal of Damage Mechanics. 13:147-161
The paper presents a constitutive model for Sn–Pb solder which captures the response of this complex material subject to a variety of load paths including fatigue loading. Internal state variables are established to characterize grain coarsening an
Publikováno v:
International Journal for Numerical Methods in Engineering. 56:2199-2211
This paper presents failure analysis of solder joints with a damage-coupled viscoplastic model. A material model is developed to characterize the elasticity, plasticity, creep and damage of solder. A semi-implicit time-integration approach is adopted
Publikováno v:
Journal of Electronic Packaging. 123:278-283
This paper presents a viscoplasticity model taking into account the effects of change in grain or phase size and damage on the characterization of creep damage in 60 Sn-40 Pb solder. Based on the theory of damage mechanics, a two-scalar damage model
Autor:
M. Holliday, Alice C. Kilgo, Jerome A. Rejent, R. Sorensen, Jennifer E. Granata, M. K. Neilsen, Benjamin B. Yang, M. Grazier, Paul T. Vianco, Jay Johnson
Publikováno v:
2013 IEEE 39th Photovoltaic Specialists Conference (PVSC).
The TurboSiP© software predicts the thermal mechanical fatigue (TMF) of commonly used solder joints. The input parameters are package materials, interconnection design, solder alloy (Sn-Pb or Pb-free), and the environment. This computational tool wa
Autor:
M. K. Neilsen, Howard L. Schreyer
Publikováno v:
International Journal for Numerical Methods in Engineering. 39:1721-1736
Material instability occurs when ellipticity is lost for symmetric constitutive equations. Prior to loss of ellipticity it is possible that the second-order work of Hill or Drucker becomes negative. There are implications in the literature that numer
Publikováno v:
Polymer Engineering and Science. 35:387-394
Rigid, closed-cell, polyurethane foam consists of interconnected polyurethane plates which form cells. When this foam is compressed, it exhibits an initial elastic regime which is followed by a plateau regime in which the load required to compress th
Publikováno v:
Journal of Electronic Packaging. 133
The present study examines the thermomechanical strain-rate sensitivity of eutectic 63Sn–37Pb solder over a broad range of strain-rates from 0.0002 s–1 to 200 s–1, thus encompassing failure events between 1 h and 1 ms, at temperatures ranging f