Zobrazeno 1 - 10
of 46
pro vyhledávání: '"M. J. VASILE"'
Autor:
C. R. Friedrich, M. J. Vasile
Publikováno v:
Microsystem Technologies. 2:144-148
Autor:
M. J. Vasile, D. L. Malm
Publikováno v:
Analytical chemistry. 44(4)
Publikováno v:
ChemInform. 22
Publikováno v:
Journal of The Electrochemical Society. 138:2061-2069
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 8:99-105
X‐ray photoelectron spectroscopy (XPS) spectra have been obtained for TiNx, with x=0.25, 0.50, and 1.0, as determined by Rutherford backscattering (RBS) analyses, and with no detectable oxygen content. We find the shape of the Ti 2p transition to b
Publikováno v:
Journal of The Electrochemical Society. 137:1319-1320
The use of the binary and quaternary systems InP and In{sub 1{minus}x}Ga{sub x}As{sub 1{minus}y}P{sub y} for the fabrication of long wavelengths (i.e., 1.3-1.6{mu}m) LED's and lasers is a well-established approach. Our work is focused on the quaterna
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 15:2350
Ion milling with a focused ion beam (FIB) is a potential method for making micromolds, which will then be the primary elements in the mass production of micro- or mini-objects by embossing or injection molding. The challenge lies in controlling the i
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 13:335
We have used a Ga+ focused ion beam (FIB) milling technique to produce sharp scanning‐probe microscope tips. The FIB procedure employs a roughly 0.2‐μm‐diam 20 keV Ga ion beam vector scanned in an annular pattern across the apex of an electroc
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 11:2473
Profilometry of high‐aspect‐ratio, submicron lithographic features with a scanning force microscope is possible if the instrument satisfies several requirements. The probe must be slender enough to reach into narrow holes without sacrificing stab
Autor:
Kevin S. Jones, E. Lane, Stephen J. Pearton, A. E. Von Neida, Nancy M. Haegel, M. J. Vasile, K. T. Short, T. R. Fullowan
Publikováno v:
Journal of Applied Physics. 65:1281-1292
The reactive ion etching of GaAs with a CCl2F2:O2 discharge was investigated as a function of gas flow rate (10–60 sccm), total pressure (2–50 mTorr), power density (0.25–1.31 W cm−2), gas composition (0%–70% O2), and etch time (1–64 min)