Zobrazeno 1 - 1
of 1
pro vyhledávání: '"M. J. Razai"'
Publikováno v:
2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
Summary form only given. Materials used in the electronic packaging industry are generally categorizes as Direct and Indirect materials. Direct materials would constitute items like substrates, underfill, thermal lids, fluxes, solder materials. On th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc997e67904044234dbe8e53a057ae56
https://doi.org/10.1109/iemt.2012.6521779
https://doi.org/10.1109/iemt.2012.6521779
