Zobrazeno 1 - 2
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pro vyhledávání: '"M. G. Scheibel"'
Autor:
Sandy Klengel, Stefan Kaessner, A. Z. Miric, M. G. Scheibel, G. Hejtmann, R. Eisele, Falk Naumann, Matthias Petzold, S. Behrendt, Klaus G. Nickel, Bianca Boettge
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
The paper introduces novel phosphate cement- and calcium aluminate cement-based material systems with enhanced thermal, mechanical and thermomechanical properties for the encapsulation of power electronic devices and modules. These materials are aimi
Publikováno v:
Microelectronics Reliability. :113430
The demands on power modules regarding power density and reliability are continuously rising. Conventional encapsulation materials are limited in their thermal performance. In this study, a completely new material class is used within a power module.