Zobrazeno 1 - 10
of 26
pro vyhledávání: '"M. Ferenets"'
Autor:
T. Tilford, M. Ferenets, J. E. Morris, A. Krumme, S. Pavuluri, P. R. Rajaguru, M. P. Y. Desmulliez, C. Bailey
Publikováno v:
Journal of Algorithms & Computational Technology, Vol 4 (2010)
A particle swarm optimisation approach is used to determine the accuracy and experimental relevance of six disparate cure kinetics models. The cure processes of two commercially available thermosetting polymer materials utilised in microelectronics m
Externí odkaz:
https://doaj.org/article/536aaca0e38a4bb09a93cf83c42200fd
Autor:
Tim Tilford, R. Adamietz, Marc P.Y. Desmulliez, Chris Bailey, F. Eicher, G. Muller, George Goussetis, S.K. Pavuluri, M. Ferenets
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:799-806
An open-ended microwave oven system is presented and characterized for the rapid encapsulation of microelectronic components. In situ real-time measurement of the temperature of the curing materials is carried out by an infrared pyrometer integrated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::26639ec10f9a1204d8096b947bd5f5a8
https://doi.org/10.1109/tcpmt.2011.2177524
https://doi.org/10.1109/tcpmt.2011.2177524
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
An approach to curing thermosetting polymers is the use of Variable Frequency Microwave (VFM) systems, which have been shown to cure encapsulant materials in substantially shorter times than conventional methods [1]. The microwave curing of thermoset
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae379623920fe6858009d95e3390ab0d
https://doi.org/10.1109/estc.2012.6542134
https://doi.org/10.1109/estc.2012.6542134
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
The accuracy of four widely used cure kinetics models in predicting the cure rate of a commercially available encapsulant material is assessed. Four nth order phenomenological cure kinetics models and the single step autocatalytic model are outlined.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e38822a1c6eeb65d42577daa7f15ba60
https://doi.org/10.1109/eptc.2011.6184428
https://doi.org/10.1109/eptc.2011.6184428
Autor:
George Goussetis, R. Adamietz, G. Muller, Tim Tilford, Marc P.Y. Desmulliez, F. Eicher, S.K. Pavuluri, Chris Bailey, M. Ferenets
An open ended microwave oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e77243f9623372cbaa6098f1993bfd19
http://gala.gre.ac.uk/id/eprint/4308/1/10_38.pdf
http://gala.gre.ac.uk/id/eprint/4308/1/10_38.pdf
Autor:
S.K. Pavuluri, F. Eicher, Tim Tilford, N. Othman, M. Ferenets, Marc P.Y. Desmulliez, G. Muller, Chris Bailey, R. Adamietz
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
In microelectronics packaging applications a variety of thermosetting polymer materials is applied. Such materials are dispensed in a liquid form and are heated with the intent to cure them. Conventional processes often take several hours to bring th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1772f1b7eaa9cdc9f2a5f3dbe5d9cb91
https://doi.org/10.1109/estc.2010.5642827
https://doi.org/10.1109/estc.2010.5642827
Autor:
M. Ferenets, Chris Bailey, Tim Tilford, James E. Morris, S.K. Pavuluri, Pushparajah Rajaguru, Marc P.Y. Desmulliez
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
This work assesses the accuracy of specific numerical models in predicting the cure kinetics of a commercially available isotropic conductive adhesive material. A series of Differential Scanning Calorimetry (DSC) analyses have been performed on the m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a99b31b633bf17bacd5bcaa0376d6a40
https://doi.org/10.1109/estc.2010.5642820
https://doi.org/10.1109/estc.2010.5642820
Autor:
Pushparajah Rajaguru, James E. Morris, Tim Tilford, Chris Bailey, Marc P.Y. Desmulliez, M. Ferenets, S.K. Pavuluri
Publikováno v:
33rd International Spring Seminar on Electronics Technology, ISSE 2010.
The electrical and thermomechanical properties of isotropic conductive adhesive materials vary significantly during the material cure process as polymer crosslinking alters the molecular structure and volume of the material which, in turn, alters the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b07a58b404cc66f2bbcf818edff7c234
https://doi.org/10.1109/isse.2010.5547360
https://doi.org/10.1109/isse.2010.5547360
Autor:
M. Ferenets, James E. Morris, A. Krumme, Pushparajah Rajaguru, Chris Bailey, Tim Tilford, S.K. Pavuluri, Marc P.Y. Desmulliez
Publikováno v:
Journal of Algorithms & Computational Technology, Vol 4 (2010)
A particle swarm optimisation approach is used to determine the accuracy and experimental relevance of six disparate cure kinetics models. The cure processes of two commercially available thermosetting polymer materials utilised in microelectronics m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dc2b1c38d12ad689fee6f83c888e541b
https://doaj.org/article/536aaca0e38a4bb09a93cf83c42200fd
https://doaj.org/article/536aaca0e38a4bb09a93cf83c42200fd
Autor:
Heikki Mattila, Minna Uotila, Osmo Hänninen, Mailis Mäkinen, Wiesława Bendkowska, Elizabeth McCullough, H. Shim, Markku Honkala, Jinlian Hu, F. Boussu, J.-L. Petitniot, G.K. Stylios, P. Talvenmaa, Robert Mather, John Wilson, A. Harlin, M. Ferenets, Tushar Ghosh, A. Dhawan, J.F. Muth, M.-Y.S. Leung, Joanna Tsang, X.-M. Tao, C.-W.M. Yuen, Yang Li, Bohwon Kim, Vladan Koncar, Claude Dufour, Cédric Cochrane, Andreas G. Neudeck, H. Mattila, M. Mäkinen, Jose S. Solaz, Juan-Manuel Belda-Lois, Ana-Cruz Garcia, Ricard Barberà, Juan-Vicente Durá, Juan-Alfonso Gomez, Carlos Soler, Jaime Prat, Tünde Kirstein, Gerhard Tröster, Ivo Locher Christof Küng, Niina Lintu, M. Mattila, O. Hänninen, Carla Hertleer, L. Van Langenhove, R. Puers, Bridget J. Munro, Toni E. Campbell, Julie R. Steele, Gordon G. Wallace, Stan S. Swallow, A.P. Thompson
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::582cfd91f290919075175d1891d319b0
https://doi.org/10.1016/b978-1-84569-343-5.50030-3
https://doi.org/10.1016/b978-1-84569-343-5.50030-3