Zobrazeno 1 - 7
of 7
pro vyhledávání: '"M. E. Lunnon"'
Publikováno v:
Journal of The Electrochemical Society. 134:2027-2030
Copper is shown to be inadvertently introduced as an impurity during the formation of silicon‐on‐insulator structures by high fluence oxygen implantation. Postimplantation annealing causes the copper to diffuse from the silicon surface through th
Autor:
M. E. Lunnon, D. W. Greve
Publikováno v:
Journal of Applied Physics. 54:3278-3281
The microstructure and programming mechanism of an electrically programmable antifuse is described. The device consists of n+pn+ junctions in polycrystalline silicon programmed by applying voltage pulses to the two n+ terminals. High voltage electron
Autor:
M. E. Lunnon, M. Delfino
Publikováno v:
Journal of The Electrochemical Society. 132:435-440
Etude par microscopie electronique des zones amorphes produites par implantation par BCl + et BF 2 + . Etude comparative du recuit a 900°C pendant 30 minutes. Caracteristiques des diodes fabriquees
Publikováno v:
Journal of The Electrochemical Society. 132:2473-2475
Obtention de diodes p-n peu profondes ayant de bonnes caracteristiques de fuite par recuit thermique rapide ou recuit dans un four de silicium implante par BF 2 + . Elimination des defauts residuels. Amelioration des caracteristiques des jonctions pe
Publikováno v:
Applied Physics Letters. 45:1056-1058
A comparison has been made between ion implantation damage, implanted impurity profiles, and the dopant electrical characteristics in silicon implanted with boron fluoride and rapid annealed. The rapid anneal is accompanied by outdiffusion of fluorin
Publikováno v:
Applied Physics Letters. 46:35-37
Rapid annealing of boron implanted (100) silicon has been used to fabricate p+‐n diodes. After an implant dose of 3×1015 ion cm−2 and a 1‐s anneal at 1100 °C, a sheet resistance of 40 Ω/⧠ is obtained. The junction depth is 0.34 μm, measur
Autor:
M. E. Lunnon, M. Delfino
Publikováno v:
Chemischer Informationsdienst. 16