Zobrazeno 1 - 2
of 2
pro vyhledávání: '"M. Dumling"'
Autor:
H. Pohlmann, M. Dumling, W. Schnitt, Antoon M. H. Tombeur, Henricus G. R. Maas, J.-H. Fock, J.R. Haartsen, Ronald Dekker, Theodorus Martinus Michielsen
Publikováno v:
2006 Bipolar/BiCMOS Circuits and Technology Meeting.
A simple and robust technology for the transfer of circuits, processed on normal silicon wafers, to alternative substrates is presented. Substrate transfer technology (STT) is a post-processing technology based on adhesive bonding using a UV curing a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ec89b883fb268699472790836c4b98d
https://doi.org/10.1109/bipol.2006.311141
https://doi.org/10.1109/bipol.2006.311141
Autor:
Theodorus Martinus Michielsen, J.-H. Fock, M. Dumling, W. Schnitt, C. Jonville, Antoon M. H. Tombeur, H. Pohlmann, Ronald Dekker, O. Gourhant
Publikováno v:
Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, 2005..
In CIRCONFLEX technology, circuits fabricated on SOI wafers are transferred to a 10 /spl mu/m thick polyimide carrier. The highly flexible circuits remain defect free even after bending to radii of less than 1 mm, making them attractive for chip-in-p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08c61f1731e404840bb25606d0384527
https://doi.org/10.1109/bipol.2005.1555192
https://doi.org/10.1109/bipol.2005.1555192