Zobrazeno 1 - 4
of 4
pro vyhledávání: '"M. Detard"'
Autor:
W. Schwarzenbach, B.-Y. Nguyen, L. Ecarnot, S. Loubriat, M. Detard, E. Cela, C. Bertrand-Giuliani, G. Chabanne, C. Maddalon, N. Daval, C. Maleville
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 7, Pp 863-868 (2019)
Beyond 65FD-SOI, 28FD-SOI, and 22FD-SOI production granted technologies, SmartCut™ development supports both advanced FD-SOI and low temperature SOI roadmaps. Ultrathin SOI and BOX materials developments are reported, including 4-nm SOI and 15-nm B
Externí odkaz:
https://doaj.org/article/edbba5752ee645b7974f97152c8b83f8
Autor:
E. Cela, Christophe Maleville, Ludovic Ecarnot, C. Maddalon, Nicolas Daval, S. Loubriat, C. Bertrand-Giuliani, Walter Schwarzenbach, Bich-Yen Nguyen, G. Chabanne, M. Detard
Publikováno v:
IEEE Journal of the Electron Devices Society
Beyond 65FD-SOI, 28FD-SOI, and 22FD-SOI production granted technologies, SmartCut™ development supports both advanced FD-SOI and low temperature SOI roadmaps. Ultrathin SOI and BOX materials developments are reported, including 4-nm SOI and 15-nm B
Autor:
Christophe Girard, M. Detard, E. Cela, Nicolas Daval, G. Chabanne, C. Bertrand-Giuliani, Christophe Maleville, Ludovic Ecarnot, Bich-Yen Nguyen, Walter Schwarzenbach, S. Loubriat, C. Maddalon
Publikováno v:
2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
Internet of Thing (IoT), wearable electronics and Automotive are big drivers for the growth of semiconductor market after the smartphone era. To achieve complex but miniaturized, ultra-low power but highly reliable circuits; to maintain sufficient pe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3cfbef59d2e34e0070af7eccf9fb4f98
Conference
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.