Výsledky vyhledávání - "M. Šikula Sharang"

Integration of Probing Capability into Plasma FIB for In-Situ Delayering, Defect Inspection, and EBAC on BEOL Defects of Sub-20nm FinFET Devices

Autor: M. Šikula Sharang, S. Kleindiek, A. Rummel, J. Vincenc Oboňa, K. Novotný, Vinod Narang, M.S. Wei, J.M. Chin, M. Kemmler, G. Goupil, D. Zudhistira

Publikováno v: International Symposium for Testing and Failure Analysis.

Deprocessing and probing are two quintessential steps in the physical failure analysis (PFA) and competitive analysis of integrated circuits (ICs). Typically, these steps are accomplished using multiple tools, which include polishers, electron micros

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::224114c37376f9f5b7b799a11231e4ea
https://doi.org/10.31399/asm.cp.istfa2018p0232

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