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pro vyhledávání: '"M V, Coleman"'
Autor:
G. E. Gurnett, M. V. Coleman
Publikováno v:
Active and Passive Electronic Components, Vol 5, Iss 1, Pp 55-59 (1978)
Externí odkaz:
https://doaj.org/article/9499f42c43404403a0eb2b494b18cb8e
Autor:
G. E. Gurnett, M. V. Coleman
Publikováno v:
Active and Passive Electronic Components, Vol 10, Iss 2-3, Pp 163-170 (1983)
Externí odkaz:
https://doaj.org/article/bd048b49f8ca4290a028f77b94505063
Publikováno v:
Journal of veterinary internal medicine. 25(4)
Microalbuminuria and C-reactive protein (CRP) are predictors of morbidity and survival in critically ill human patients.To evaluate results of microalbuminuria assays (untimed single-sample urine albumin concentration [U-ALB] and the urine albumin:cr
Autor:
M. V. Coleman, G. E. Gurnett
Publikováno v:
Active and Passive Electronic Components, Vol 5, Iss 1, Pp 55-59 (1978)
The properties of reactively bonded gold conductors have been compared with a fritted gold conductor (DuPont 9260). Several different additives in the gold conductors were examined, including copper/copper oxide; copper plus cadium/germanium and copp
Autor:
M. V. Coleman, D. J. D. Thomas
Publikováno v:
physica status solidi (b). 24:K111-K115
Autor:
M. V. Coleman, D. J. D. Thomas
Publikováno v:
Physica Status Solidi (b). 25:241-252
In an amorphous material the scattered intensity of electron waves depends, in part, on its structure. The variation of the scattered intensity with angle may be mathematically transformed to give a radial distribution function (RDF) which describes
Autor:
M. V. Coleman
Publikováno v:
Adhesion 9 ISBN: 9789401086882
Thick film conductors consist of a metallic phase which, after firing, adheres to 96% alumina substrates. The method of adhesion depends upon deliberate minority constituents added to the conductor ink which forms the bonding layer between the metal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::969b7362c4b3be0a637538e5a8fd21c5
https://doi.org/10.1007/978-94-009-4938-6_5
https://doi.org/10.1007/978-94-009-4938-6_5
Autor:
G. E. Gurnett, M. V. Coleman
Publikováno v:
Gold Bulletin. 10:74-75
Conventional thick film conductors rely for their adhesion on the formation of a glassy layer which keys them both chemically and mechanically to the substrate surface. A newer type of conductor contains no glass frit but is reactively-bonded to the