Zobrazeno 1 - 4
of 4
pro vyhledávání: '"M S N Ibrahim"'
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 429:012069
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5bd1befc6df350a8ce8d6a5bbb78e84
https://doi.org/10.1088/1757-899x/429/1/012069
https://doi.org/10.1088/1757-899x/429/1/012069
Publikováno v:
Journal of Physics: Conference Series. 734:032106
Numerical analysis of hot stamping process is very complex mainly due to thermomechanical processes involved. Many variables such as heat transfer coefficient, density, young modulus and other thermal parameters are temperature and pressure dependent
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03c454d17c8ea09f543ce67e4d3cacd8
https://doi.org/10.1088/1742-6596/734/3/032106
https://doi.org/10.1088/1742-6596/734/3/032106
Autor:
Ahmad Zakaria, M S N Ibrahim
Publikováno v:
IOP Conference Series: Materials Science & Engineering; Jan2020, Vol. 715 Issue 1, p1-1, 1p
Publikováno v:
Journal of Physics: Conference Series; 2016, Vol. 734 Issue 3, p1-1, 1p