Molded Substrates for Inkjet Printed Modules.

Autor: Miettinen, Jani, Kaija, Kimmo, Mäfttysalo, Matti, Mansikkamäki, Pauliina, Kuchiki, Mikiharu, Tsubouchi, Mikihiko, Rönkkä, Risto, Hashizume, Kenichi, Kamigori, Akiko

Publikováno v: IEEE Transactions on Components & Packaging Technologies; Jun2009, Vol. 32 Issue 2, p293-301, 9p, 2 Charts, 6 Graphs