Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Lutz Stobbe"'
Autor:
Tanja Braun, Ole Holck, Mattis Obst, Steve Voges, Ruben Kahle, Lars Bottcher, Mathilde Billaud, Lutz Stobbe, Karl-Friedrich Becker, Rolf Aschenbrenner, Marcus Voitel, Friedrich-Leonhard Schein, Lutz Gerholt, Martin Schneider-Ramelow
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::887a6880363d374ec8b9f1a684099501
https://doi.org/10.1109/ectc51906.2022.00133
https://doi.org/10.1109/ectc51906.2022.00133
Publikováno v:
Sustainable Production, Life Cycle Engineering and Management ISBN: 9789811567742
This paper presents important methodical aspects in conjunction with the ongoing development of a novel multi-level-model in support of lifecycle environmental assessments of telecommunication networks. The new approach is, to some extent, emulating
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8da985901c0e6f9cc2e06c2d6116081
https://doi.org/10.1007/978-981-15-6775-9_15
https://doi.org/10.1007/978-981-15-6775-9_15
Autor:
Lutz Stobbe, K.-F. Becker, Martin Schneider-Ramelow, K-D. Lang, Lars Boettcher, Ole Hoelck, M. Voitel, Tanja Braun, Steve Voges, Michael Topper, Rolf Aschenbrenner
Publikováno v:
2019 IEEE CPMT Symposium Japan (ICSJ).
Drivers for 3D packaging solutions are manifold and each requirement calls for different answers and technologies. Main goal is miniaturization, but component density and performance, simplification of design and assembly, flexibility, functionality
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5867a6d0121cd950d3f7c9fbf2bb3574
https://doi.org/10.1109/icsj47124.2019.8998753
https://doi.org/10.1109/icsj47124.2019.8998753
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
In response to the emerging trends in packaging technologies, detailed cost analysis models are required to assess the economical and environmental feasibility of different technology options, business scenarios, design options, and process configura
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e857207ebfc22fe2e3dca49eb5040662
https://doi.org/10.23919/empc44848.2019.8951756
https://doi.org/10.23919/empc44848.2019.8951756
Publikováno v:
Technologies and Eco-innovation towards Sustainability I ISBN: 9789811311802
The energy and overall environmental footprint of the Internet and the increasing data traffic is of public and political concern. Such quantification would require substantial international measurement campaigns and in effect the collection of large
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86eb139b86c2850fffeab4989688d292
https://doi.org/10.1007/978-981-13-1181-9_5
https://doi.org/10.1007/978-981-13-1181-9_5
Autor:
Martin Schneider-Ramelow, Rolf Aschenbrenner, Tanja Braun, Karl-Friedrich Becker, Mathilde Billaud, Lutz Stobbe, Ole Hoelck, Markus Wohrmann, Michael Topper, S. Voges, Lars Boettcher, Klaus-Dieter Lang, Hannes Zedel
Publikováno v:
2018 International Wafer Level Packaging Conference (IWLPC).
Panel Level packaging (PLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration also larger substrates formats are targeted. Fan-out Wafer Level manufacturing is currently done
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8e389a68d48703e1fe5f357451906c8
https://doi.org/10.23919/iwlpc.2018.8573277
https://doi.org/10.23919/iwlpc.2018.8573277
Autor:
Rolf Aschenbrenner, K.-F. Becker, Lutz Stobbe, Tanja Braun, R. Kahle, S. Voges, Michael Topper, Lars Boettcher, Hannes Zedel, Ole Hoelck, K-D. Lang, Martin Schneider-Ramelow, Markus Wohrmann
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration including multiple die packaging, passive component integration in package and redistri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d019f012bbac9600b3389197695ac915
https://doi.org/10.1109/ectc.2018.00019
https://doi.org/10.1109/ectc.2018.00019
Publikováno v:
2016 Electronics Goes Green 2016+ (EGG).
Public authorities have an important role to play in mainstreaming green procurement for ICT. However, a life-cycle thinking approach in the procurement process is necessary today. Several LCA studies have shown that the manufacturing phase of ICT pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad578b0497a54497b93d499f8a07d44c
https://doi.org/10.1109/egg.2016.7829853
https://doi.org/10.1109/egg.2016.7829853
Publikováno v:
2016 Electronics Goes Green 2016+ (EGG).
Based on the data of a recent study, the paper will show and analyse the factors that contribute to the fast improvement of energy efficiency of ICT end-user devices over the past years. The main purpose of the paper is to outline future developments
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57e449d76390cdee63943f1308235f6c
https://doi.org/10.1109/egg.2016.7829822
https://doi.org/10.1109/egg.2016.7829822
Publikováno v:
2016 Electronics Goes Green 2016+ (EGG).
The advancing digitization of all areas of the economy and society is generating significantly increasing demand for processing power. More and more data centers of ever larger size are being built worldwide, and their electricity consumption is cons
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c25d81c7e14ef8ea3682c18c97e0105c
https://doi.org/10.1109/egg.2016.7829805
https://doi.org/10.1109/egg.2016.7829805