Zobrazeno 1 - 10
of 30
pro vyhledávání: '"Luting, Liu"'
Publikováno v:
Photodiagnosis and Photodynamic Therapy, Vol 48, Iss , Pp 104275- (2024)
Purpose: To measure the choroidal circulatory parameters Han Chinese children aged 4–14 years from Southwest China, and to explore the relationships between these parameters and age, axial length (AL), and choroidal thickness (ChT). Methods: 284 ey
Externí odkaz:
https://doaj.org/article/7f858924c01a49a190d756fe76c2a623
Autor:
Yingmeng Zhang, Shaojun Li, Luting Liu, Yihan Lin, Shengyang Jiang, Yongliang Li, Xiangzhong Ren, Peixin Zhang, Lingna Sun, Hui Ying Yang
Publikováno v:
ACS Applied Materials & Interfaces. 14:33064-33075
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0dcf5c4126d0c27be47572055db29948
https://doi.org/10.1021/acsami.2c05262
https://doi.org/10.1021/acsami.2c05262
Autor:
Xiangzhong Ren, Yongliang Li, Wanlin Wu, Peixin Zhang, Lingna Sun, Qingwei Deng, Yingmeng Zhang, Luting Liu
Publikováno v:
Chinese Journal of Chemical Engineering. 47:185-192
Hybrid CuO-Co3O4 nanosphere building blocks have been embedded between the layered nanosheets of reduced graphene oxides with a 3D hybrid architecture (CuO-Co3O4-RGO), which are successfully applied as enhanced anodes for lithium-ion batteries (LIBs)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97129ab1e70c88bc6ea7eb55eee21ae6
https://doi.org/10.1016/j.cjche.2021.06.026
https://doi.org/10.1016/j.cjche.2021.06.026
Autor:
Luting Liu, Yong Zhuo, Haoqi Zhang, Jing Li, Xuemei Jiang, Xingfa Han, Jin Chao, Bin Feng, Lianqiang Che, Shengyu Xu, Yan Lin, Jian Li, Zhengfeng Fang, Mengmeng Sun, Ting Luo, De Wu, Lun Hua
Publikováno v:
The Journal of Nutrition.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce5373c630822369e527ff3b9cfc4993
https://doi.org/10.1016/j.tjnut.2023.04.012
https://doi.org/10.1016/j.tjnut.2023.04.012
Publikováno v:
Journal of Biomedical Nanotechnology. 18:868-874
For this first time, this study utilized Accelerated Neutral Atom Beam (ANAB) technology to modify polypropylene to inhibit bacteria colonization in vitro after 24 hours without the use of drugs or antibiotics. Specifically, ANAB was designed and use
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2a5ae65aa393e11b9fd8920d47839c38
https://doi.org/10.1166/jbn.2022.3269
https://doi.org/10.1166/jbn.2022.3269
Publikováno v:
Journal of Electronic Materials. 48:6835-6848
Sn-15Bi solid solution solder provides a potential replacement for Sn-40Pb solder due to lower cost and similar melting point. Sn-15Bi solder was compared with Sn-40Pb solder to assess the microstructure, wettability, bulk tensile properties, interfa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42719c8abf765048b29a4597b4f38ea8
https://doi.org/10.1007/s11664-019-07473-3
https://doi.org/10.1007/s11664-019-07473-3
Publikováno v:
Journal of Materials Science: Materials in Electronics. 30:3222-3243
With the implementation of legislations on inhibiting the usage of Sn–Pb solder in consumer electronic products, Sn–Ag–Cu series solder has been gotten the most application. However, there are some stimulations from electronic manufacturers to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3afaf46de8d0b5643d3afc63c0e623ff
https://doi.org/10.1007/s10854-019-00701-w
https://doi.org/10.1007/s10854-019-00701-w
Publikováno v:
ACS biomaterials scienceengineering. 2(1)
Catheter-associated infections, most of which are caused by microbial biofilms, are still a serious issue in healthcare and are associated with significant morbidity, mortality, and excessive medical costs. Currently, the use of nanostructured materi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9666d45e0cc29507eac71e003ba9fac8
https://pubmed.ncbi.nlm.nih.gov/33418649
https://pubmed.ncbi.nlm.nih.gov/33418649
Publikováno v:
Journal of Materials Science: Materials in Electronics. 29:21157-21169
Sn–58Bi eutectic solder is attracted much attention to replace Sn–Ag–Cu Pb-free solder due to its lower melting temperature in recent years. However, its low melting temperature also raised serious electromigration (EM) reliability due to the a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e531da901ebdd595bbeae24bf5309332
https://doi.org/10.1007/s10854-018-0264-x
https://doi.org/10.1007/s10854-018-0264-x