Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Luth CJ"'
Autor:
Nibhanupudi SST; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States., Roy A; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States.; Department of Physics, Birla Institute of Technology Mesra, Ranchi, Jharkhand 835215, India., Chowdhury S; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States., Schalip R; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States., Coupin MJ; Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States., Matthews KC; Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States., Alam MH; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States., Satpati B; Surface Physics and Material Science Division, Saha Institute of Nuclear Physics, 1/AF, Bidhannagar, Kolkata 700 064, India., Movva HCP; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States., Luth CJ; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States., Wu S; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States., Warner JH; Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States., Banerjee SK; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States.
Publikováno v:
ACS applied materials & interfaces [ACS Appl Mater Interfaces] 2024 May 01; Vol. 16 (17), pp. 22326-22333. Date of Electronic Publication: 2024 Apr 18.
Autor:
Song M; Microelectronic Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States., Lee S; Microelectronic Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States., Nibhanupudi SST; Microelectronic Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States., Singh JV; Microelectronic Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States., Disiena M; Microelectronic Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States., Luth CJ; Microelectronic Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States., Wu S; Microelectronic Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States., Coupin MJ; Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas 78712, United States., Warner JH; Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas 78712, United States., Banerjee SK; Microelectronic Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, United States.
Publikováno v:
Nano letters [Nano Lett] 2023 Apr 12; Vol. 23 (7), pp. 2952-2957. Date of Electronic Publication: 2023 Mar 30.
Autor:
Yang SJ; Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States., Dahan MM; Viterbi Faculty of Electrical & Computer Engineering, Technion - Israel Institute of Technology, Haifa 32000, Israel., Levit O; Viterbi Faculty of Electrical & Computer Engineering, Technion - Israel Institute of Technology, Haifa 32000, Israel., Makal F; Rohde&Schwarz USA, Inc., Columbia, Maryland 21046, United States., Peterson P; Rohde&Schwarz USA, Inc., Columbia, Maryland 21046, United States., Alikpala J; FormFactor, Inc., Livermore, California 94551, United States., Nibhanupudi ST; Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States., Luth CJ; Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States., Banerjee SK; Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States., Kim M; Department of Electrical and Computer Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan 44919, South Korea., Roessler A; Rohde&Schwarz USA, Inc., Columbia, Maryland 21046, United States., Yalon E; Viterbi Faculty of Electrical & Computer Engineering, Technion - Israel Institute of Technology, Haifa 32000, Israel., Akinwande D; Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States.
Publikováno v:
Nano letters [Nano Lett] 2023 Feb 22; Vol. 23 (4), pp. 1152-1158. Date of Electronic Publication: 2023 Jan 20.
Autor:
Lanphere JD; Department of Chemical and Environmental Engineering, University of California , Riverside, California., Luth CJ; Department of Chemical and Environmental Engineering, University of California , Riverside, California., Guiney LM; Department of Material Science and Engineering, Chemistry, and Medicine, Northwestern University , Evanston, Illinois., Mansukhani ND; Department of Material Science and Engineering, Chemistry, and Medicine, Northwestern University , Evanston, Illinois., Hersam MC; Department of Material Science and Engineering, Chemistry, and Medicine, Northwestern University , Evanston, Illinois., Walker SL; Department of Chemical and Environmental Engineering, University of California , Riverside, California.
Publikováno v:
Environmental engineering science [Environ Eng Sci] 2015 Feb 01; Vol. 32 (2), pp. 163-173.
Autor:
Lanphere JD; Department of Chemical and Environmental Engineering, University of California, Riverside, California 92521, USA., Luth CJ, Walker SL
Publikováno v:
Environmental science & technology [Environ Sci Technol] 2013 May 07; Vol. 47 (9), pp. 4255-61. Date of Electronic Publication: 2013 Apr 10.