Zobrazeno 1 - 10
of 47
pro vyhledávání: '"Luo, Si‐Chun"'
Autor:
Zeng, Lingyong, Hu, Xunwu, Zhou, Yazhou, Boubeche, Mebrouka, Guo, Ruixin, Liu, Yang, Luo, Si-Chun, Guo, Shu, Li, Kuan, Yu, Peifeng, Zhang, Chao, Guo, Wei-Ming, Sun, Liling, Yao, Dao-Xin, Luo, Huixia
Topological superconductors have drawn significant interest from the scientific community due to the accompanying Majorana fermions. Here, we report the discovery of electronic structure and superconductivity in high-entropy ceramics Ti0.2Zr0.2Nb0.2M
Externí odkaz:
http://arxiv.org/abs/2310.14271
Autor:
Zeng, Lingyong, Wang, Zequan, Song, Jing, Lin, Gaoting, Guo, Ruixin, Luo, Si-Chun, Guo, Shu, Li, Kuan, Yu, Peifei, Zhang, Chao, Guo, Wei-Ming, Ma, Jie, Hou, Yusheng, Luo, Huixia
Publikováno v:
Adv. Funct. Mater. 2023, 2301929
High-entropy ceramics (HECs) are solid solutions of inorganic compounds with one or more Wyckoff sites shared by equal or near-equal atomic ratios of multi-principal elements. Material design and property tailoring possibilities emerge from this new
Externí odkaz:
http://arxiv.org/abs/2307.02020
Publikováno v:
In Journal of the European Ceramic Society March 2024 44(3):1404-1411
Autor:
Zhou, Yu-Zhang, Huang, Kun-Heng, Bo, Guang-Xu, Luo, Si-Chun, Guo, Wei-Ming, Sun, Shi-Kuan, Lin, Hua-Tay
Publikováno v:
In Ceramics International 1 November 2023 49(21):33652-33658
Publikováno v:
In Ceramics International 1 April 2023 49(7):10280-10286
Akademický článek
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Publikováno v:
In Journal of the European Ceramic Society February 2022 42(2):336-343
Publikováno v:
In Journal of the European Ceramic Society June 2021 41(6):3189-3195
Autor:
He, Sheng‐Jin1 (AUTHOR), Luo, Si‐Chun2 (AUTHOR), Guo, Wei‐Ming1 (AUTHOR) guo1238@126.com, Wei, Wan‐Xin3 (AUTHOR), Lin, Hua‐Tay1 (AUTHOR)
Publikováno v:
International Journal of Applied Ceramic Technology. May2023, Vol. 20 Issue 3, p1990-1996. 7p.
Autor:
Luo, Si‐Chun1,2 (AUTHOR), Guo, Wei‐Ming1 (AUTHOR) guo1238@126.com, Lin, Hua‐Tay1 (AUTHOR) huataylin@comcast.net
Publikováno v:
Journal of the American Ceramic Society. Feb2023, Vol. 106 Issue 2, p933-940. 8p.