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Autor:
Jen-Hsiang Liu, Jenn-Ming Song, Wei-Chen Huang, Chin-Huang Chang, Chi-Lin Huang, Lung-Tang Hung, Shih-Chieh Chao, Po-Yen Shen
Publikováno v:
Microelectronics Reliability. 99:161-167
This study investigates surface oxidized layers of Cu-Fe-Zn-P (C194) and Cu-Ni-Si-Mg (C7025) lead frames under different oxidation conditions and their influence on the adhesion of epoxy molding compounds with lead frames. Micro-etching and electropl