Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Lung-Tai Chen"'
Publikováno v:
Sensors, Vol 9, Iss 8, Pp 6200-6218 (2009)
A novel plastic packaging of a piezoresistive pressure sensor using a patterned ultra-thick photoresist is experimentally and theoretically investigated. Two pressure sensor packages of the sacrifice-replacement and dam-ring type were used in this st
Externí odkaz:
https://doaj.org/article/dc3342bc097c4572a4d50f09118a94e1
Autor:
Lung-tai Chen, 陳榮泰
97
This dissertation proposes a novel packaging methodology for micro-electro-mechanical systems (MEMS) based pressure sensors by using a patterned ultra-thick (150
This dissertation proposes a novel packaging methodology for micro-electro-mechanical systems (MEMS) based pressure sensors by using a patterned ultra-thick (150
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/2mm386
Autor:
Lung-Tai Chen, Kun-Hung Hsieh, Sin-Yong Liang, Jenn-Ming Song, Ming-Yan Lai, Chi-Nan Cheng, Tsung-Yun Pai, Hsin Yi Lee
Publikováno v:
RSC Advances. 6:97449-97454
Reduction and coalescence for carboxylate-capped Ag nanoparticles can be achieved in several minutes by soaking the nanoparticle deposits in ascorbic acid aqueous solution. The reduced deposits exhibit a low electrical resistivity in the same order a
Autor:
Lung-Tai Chen1,2 rexchen@itri.org.tw, Jin-Sheng Chang1 jimmychang@itri.org.tw, Chung-Yi Hsu1 enoshhsu@itri.org.tw, Wood-Hi Cheng2 whcheng@mail.nsysu.edu.tw
Publikováno v:
Sensors (14248220). 2009, Vol. 9 Issue 8, p6200-6218. 19p. 7 Diagrams, 2 Charts, 6 Graphs.
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
Taking the advantage of low sintering temperature and high processing flexibility, metallic nanoparticles (NPs) have been widely used to fabricate interconnections. To obtain excellent electrical conductivity, the surfactants protecting the nanoparti
Autor:
Lung-Tai Chen
Publikováno v:
Sensors and Actuators A: Physical. 157:47-53
This study reports the packaging effects of wafer-level chip scale packaging (WL-CSP) with a central opening on piezoresistive pressure sensors. A regular pressure sensor with calculated sensitivity of 3.1 × 10 −2 mVV −1 kPa −1 and a sensitive
Autor:
Wood-Hi Cheng, Lung-Tai Chen
Publikováno v:
Sensors and Actuators A: Physical. 152:261-266
In this study, wafer-level chip scale packaging (WL-CSP) for piezoresistive pressure sensors using a dry-film shielding approach is demonstrated. A sensing-channel opening just above the silicon membrane of the pressure sensor is reserved in the pack
Autor:
Lung-Tai Chen, Wood-Hi Cheng
Publikováno v:
Sensors and Actuators A: Physical. 149:165-171
This study presents a novel plastic package for piezoresistive pressure sensors. A photoresist dam-ring patterned using the lithographic process is spin-coated on a piezoresistive pressure sensor to define a sensing channel in the pressure sensor pac
Publikováno v:
Sensors and Actuators A: Physical. 147:522-528
This study applies conventional micro-electro-mechanical systems (MEMS) techniques to develop a novel low-cost humidity sensor comprising a silicon substrate, a freestanding cantilever and an integrated resistive thermal sensor. The cantilever has a
Publikováno v:
BioCAS
In recent years, the wireless implantable biomicrosystems provide desirable approach for long-term nerve stimulation and physiological signal monitoring. This study aimed to implement implantable biomicrosystems which include a bladder pressure sensi