Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Lukasz Starzak"'
Publikováno v:
MIXDES
An active heating system has been developed for application in smart clothing for mountain rescuers. It uses a set of sensors and is aimed at gathering necessary data for the elaboration and testing of the automatic control algorithm. The system is p
Autor:
Jedrzej Topilko, Lukasz Starzak, Andrzej Napieralski, Grzegorz Jablonski, Paweł Janus, Mariusz Zubert, Marcin Janicki, Tomasz Raszkowski
Publikováno v:
MIXDES
The paper presents a concept of experimental determination of parameters of the Dual-Phase-Lag (DPL) model of heat flow in solids at the nanoscale. A custom chip manufactured for this purpose has been described. The possible measurement methods have
Publikováno v:
MIXDES
In this work, a new behavioural model for SiC MOSFETs under forward bias has been presented. Its novel relationships enable to achieve higher accuracy of characteristics representation over a wide temperature range. In order to prove its universal ap
Publikováno v:
2018 XIV-th International Conference on Perspective Technologies and Methods in MEMS Design (MEMSTECH).
In this paper we present the design of one-axis comb-drive accelerometer. The 3-D model of such device was built and parameterized in Comsol. The scale factor was applied in order to enlarge the structure and increase the sensor performance. Mechanic
Publikováno v:
MIXDES
SPICE models of silicon carbide power MOSFETs provided by manufacturers currently present on the market have been compared. Model subcircuit topologies have been identified and described. Principal equations have been extracted and related to common
Publikováno v:
MIXDES
SPICE models of four silicon carbide power MOSFETs provided by present commercial manufacturers have been experimentally validated and their accuracy has been assessed. The analysis has covered forward and reverse static output characteristics as wel
Publikováno v:
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Silicon carbide MOSFETs coming from every manufacturer selling on the market have been simulated using models provided by the respective manufacturers. Simulation results have been compared to datasheet characteristics. Discrepancies were identified
Publikováno v:
2017 14th International Conference The Experience of Designing and Application of CAD Systems in Microelectronics (CADSM).
This work compares four SiC power MOSFET models for SPICE provided by main device manufacturers: STMicroelectronics, CREE and ROHM. Model complexity and structures are analysed. Model accuracy is assessed by comparing simulation results to static out
Publikováno v:
Applied Sciences, Vol 14, Iss 2, p 586 (2024)
Intense physical activity and high ambient temperature cause construction workers to be exposed to an increased risk of overheating, especially in the summer season. Personal cooling systems have great potential to support workers’ thermoregulation
Externí odkaz:
https://doaj.org/article/f02524c7343f42c28a530881b6e0e7f3
Autor:
Tomasz Pozniak, Marcin Janicki, Lukasz Starzak, M. Napieralska, Andrzej Napieralski, Mariusz Zubert, Grzegorz Jablonski
Publikováno v:
Microelectronics Journal. 43:312-320
The paper presents a SiC merged PiN Schottky diode model dedicated to the dynamic as-well-as very accurate static simulation. The model takes into account the temperature dependence of device characteristics and combines in a single model the behavio