Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Lukas Tinschert"'
Publikováno v:
Microelectronics Reliability. 64:519-523
The demands on reliable and fault tolerant power electronic devices are increasing. One opportunity to increase the IGBT short circuit ruggedness is to modify the thermal capacitance and the thermal resistance close to the chip and hence extend the p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d6ecd8d829ab9dfccd9f2e4de0e7d58
https://doi.org/10.1016/j.microrel.2016.07.140
https://doi.org/10.1016/j.microrel.2016.07.140
Publikováno v:
Microelectronics Reliability. 55:903-911
Reliability of Press-Pack IGBTs is a topic with limited published data and information. This paper presents results of a power cycling test with state-of-the-art high power devices. An accelerated lifetime test scheme was defined, and six out of eigh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3bd782588c4abfbb0f7d29cd78a57c94
https://doi.org/10.1016/j.microrel.2015.02.019
https://doi.org/10.1016/j.microrel.2015.02.019
Publikováno v:
2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD).
The evaluation of power cycling results needs correct measurement of the course of thermal resistance. Hence an accurate online measurement of the junction temperature is necessary. Different measurement and power cycling methods were evaluated. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90a5f21d2850bd9ff6b5de0b291c04f9
https://doi.org/10.23919/ispsd.2017.7988994
https://doi.org/10.23919/ispsd.2017.7988994
Publikováno v:
2015 17th European Conference on Power Electronics and Applications (EPE'15 ECCE-Europe).
The point of highest mechanical load in an interconnect layer, where crack propagation will start, depends strongly on geometry and material of the attached die as it was already indicated by the CIPS08 lifetime model for insulated models [1]. Theref
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::499bbc3a3896ed51392a2c0f85d4d69c
https://doi.org/10.1109/epe.2015.7311765
https://doi.org/10.1109/epe.2015.7311765
Publikováno v:
2013 15th European Conference on Power Electronics and Applications (EPE).
The submodel technique was mainly developed in mechanical engineering for complex parts and assemblies. In the simulations of microelectronics housing the technique was successful implemented for thermal cycling conditions. In thispaper the evaluatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1a0070abed56080a98904c04c1e7961
https://doi.org/10.1109/epe.2013.6634614
https://doi.org/10.1109/epe.2013.6634614