Copper-SiOC-AirGap integration in a double level metal interconnect.

Autor: Demolliens, O., Morand, Y., Fayolle, M., Cochet, M., Assous, M., Feldis, H., Lonis, D., Royer, J.C., Gobil, Y., Passemard, G., Maury, P., Jourdan, F., Cordeau, M., Morel, T., Perroud, L., Ulmer, L., Lugard, J.F., Renaud, D.

Publikováno v: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407); 2000, p276-277, 2p