Enhanced Thermal Boundary Conductance across GaN/SiC Interfaces with AlN Transition Layers.

Autor: Li R; Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States., Hussain K; Department of Electrical Engineering, University of South Carolina, Columbia, South Carolina 29208, United States., Liao ME; Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States., Huynh K; Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States., Hoque MSB; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States., Wyant S; Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States., Koh YR; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States., Xu Z; Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States., Wang Y; Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States., Luccioni DP; Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States., Cheng Z; George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States., Shi J; George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States., Lee E; Department of Electronic Engineering, Kyung Hee University, Yongin-si 17104, Gyeonggi-do, South Korea., Graham S; George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States., Henry A; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States., Hopkins PE; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.; Department of Materials Science and Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.; Department of Physics, University of Virginia, Charlottesville, Virginia 22904, United States., Goorsky MS; Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States., Khan MA; Department of Electrical Engineering, University of South Carolina, Columbia, South Carolina 29208, United States., Luo T; Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States.; Department of Chemical and Biomolecular Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States.; Center for Sustainable Energy of Notre Dame (ND Energy), University of Notre Dame, Notre Dame, Indiana 46556, United States.

Publikováno v: ACS applied materials & interfaces [ACS Appl Mater Interfaces] 2024 Feb 14; Vol. 16 (6), pp. 8109-8118. Date of Electronic Publication: 2024 Feb 05.