Measurement of Residual Stress and Young’s Modulus on Micromachined Monocrystalline 3C-SiC Layers Grown on 111 and Silicon

Autor: Sergio Sapienza, Matteo Ferri, Luca Belsito, Diego Marini, Marcin Zielinski, Francesco La Via, Alberto Roncaglia

Publikováno v: Micromachines, Vol 12, Iss 9, p 1072 (2021)

3C-SiC is an emerging material for MEMS systems thanks to its outstanding mechanical properties (high Young’s modulus and low density) that allow the device to be operated for a given geometry at higher frequency. The mechanical properties of this

Externí odkaz: https://doaj.org/article/fe2849df88c248768ae25476a87042b0

Correlation between Q-Factor and Residual Stress in Epitaxial 3C-SiC Double-Clamped Beam Resonators

Autor: Sergio Sapienza, Matteo Ferri, Luca Belsito, Diego Marini, Marcin Zielinski, Francesco La Via, Alberto Roncaglia

Publikováno v: Materials Science Forum. 1089:57-61

In this work, we investigate the correlation between tensile residual stress and Q-factor of double-clamped beams fabricated on epitaxial 3C-SiC layers grown on both and silicon substrates, using a completely optical measurement setup to measure the

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a4a26a5d836fbe7f5c0e15f41f262bce
https://doi.org/10.4028/p-3g82bg

Development of Weighing Systems with Improved Dynamic Range Using High-Resolution Resonant MEMS Strain Sensors

Autor: M. Ferri, Luca Masini, Luca Belsito, Alberto Roncaglia

Publikováno v: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers).

The application of high-resolution MEMS strain sensors based on micromechanical resonators fabricated with wafer-level vacuum packaging to the construction of large dynamic range weighing systems is explored. Resonant sensors with sub-nano strain res

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a325893677a10b2e5ff4ddc49e4f526b
https://doi.org/10.1109/transducers50396.2021.9495570

Design and fabrication of very small MEMS microphone with silicon diaphragm supported by Z-shape arms using SOI wafer

Autor: Luca Belsito, Bahram Azizollah Ganji, Alberto Roncaglia, Sedighe Babaei Sedaghat

Publikováno v: Solid-state electronics 148 (2018): 27–34. doi:10.1016/j.sse.2018.07.004
info:cnr-pdr/source/autori:Ganji, Bahram Azizollah; Sedaghat, Sedighe Babaei; Roncaglia, Alberto; Belsito, Luca/titolo:Design and fabrication of very small MEMS microphone with silicon diaphragm supported by Z-shape arms using SOI wafer/doi:10.1016%2Fj.sse.2018.07.004/rivista:Solid-state electronics/anno:2018/pagina_da:27/pagina_a:34/intervallo_pagine:27–34/volume:148

This paper will focus on design, fabrication and characterization of a new MEMS capacitive microphone with the perforated diaphragm supported by Z-shape arms using SOI wafer. The aim is to fabricate a new microphone with the smallest size, simple and

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::989b1a8d653031051af4a2e69e087908
https://doi.org/10.1016/j.sse.2018.07.004

Measurement of Residual Stress and Young’s Modulus on Micromachined Monocrystalline 3C-SiC Layers Grown on <111> and <100> Silicon

Autor: Luca Belsito, Marcin Zielinski, Sergio Sapienza, Francesco La Via, M. Ferri, Alberto Roncaglia, Diego Marini

Publikováno v: Micromachines. 12:1072

3C-SiC is an emerging material for MEMS systems thanks to its outstanding mechanical properties (high Young’s modulus and low density) that allow the device to be operated for a given geometry at higher frequency. The mechanical properties of this

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::0c995315c528fad10fc051ab07ddd1a7
https://doi.org/10.3390/mi12091072