Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Luc Belanger"'
Autor:
Pierre-Luc Bélanger
Yannick et ses deux meilleurs amis quittent leur Ontario rural pour se rendre à Terre-Neuve. Ils sont attendus par une tante pour entamer les travaux de réfection d'une demeure ancienne destinée à devenir une auberge. Fuyant sa vie familiale diff
Autor:
Pierre-Luc Bélanger
Un jeune homme, Cédric Poitras, accumule les mauvais coups depuis son entrée au secondaire : cours séchés, vols à l'étalage, alcool… rien ne semble l'arrêter. À bout de nerfs, ses parents l'expédient chez son grand-père paternel, proprié
Autor:
David Danovitch, G. P. Brouillete, M. R. Turgeon, Valerie Oberson, Peter A. Gruber, Jean-Luc Landreville, D. T. Naugle, Luc Belanger, Da-Yuan Shih, Christopher L. Tessler
Publikováno v:
IBM Journal of Research and Development. 49:621-639
As the demand for flip-chip interconnects mounts across an increasingly large spectrum of products and technologies, several wafer-bumping proeesses have been developed to produce the small solder features required for this interconnect technology. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8004832713cc423189fb9b2b8e7dc1f3
https://doi.org/10.1147/rd.494.0621
https://doi.org/10.1147/rd.494.0621
Autor:
Pierre-Luc Bélanger
Ainé d'une famille unie, beau bonhomme et bon joueur de football, Sébastien Tardif a un bel avenir devant lui. Mais un jour, le malheur heurte sa famille de plein fouet, après un grave accident qui plonge la mère dans un profond coma. Sébastien
Publikováno v:
Birds, Vol 2, Iss 4, Pp 476-491 (2021)
Farm ponds are among the last remaining lentic wetland habitats in human-dominated agricultural and suburban landscapes. However, their wildlife value and farmers’ willingness to maintain them for the conservation of regionally declining biodiversi
Externí odkaz:
https://doaj.org/article/488ae39badc145b68fc099ed89775781
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
The rising production levels on flip chip large dies (15 to 26 mm square) and low stand off solder C4's has brought to light greater process sensitivity with respect to the formation of voids in underfills. The formation of voids is a result of flow
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c991c0d77cb993ff9b9664b2e3cb361d
https://doi.org/10.1109/ectc.2011.5898635
https://doi.org/10.1109/ectc.2011.5898635
Autor:
Michael A. Gaynes, Marie-Claude Paquet, Luc Belanger, David L. Questad, M. Sylvestre, Eric Duchesne
Publikováno v:
56th Electronic Components and Technology Conference 2006.
The role of underfills is expanding from preserving solder joint reliability to also protecting fragile low-k chip dielectric layers. Traditionally, solder joints required stiff and rigid underfills. Today, low-k layers require more compliant underfi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::360053eb6312aeb7fed03eaf79cdaf04
https://doi.org/10.1109/ectc.2006.1645870
https://doi.org/10.1109/ectc.2006.1645870
Autor:
Eric D. Perfecto, Hai P. Longworth, Eric Laine, K. Ruhmer, D. Hawken, Michel Turgeon, Luc Belanger
Publikováno v:
2006 8th Electronics Packaging Technology Conference.
To meet nature requirements for cost, size, weight and electrical performance, microelectronic packaging is moving from wire bonds to solder bumps as the preferred method of interconnection from the device to the chip carrier or card. Flip chip in pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f88617c95214cbd4a3d038f7a4b1a8d4
https://doi.org/10.1109/eptc.2006.342782
https://doi.org/10.1109/eptc.2006.342782
Autor:
Valerie Oberson, Da-Yuan Shih, M. R. Turgeon, H. Kimura, Guy Paul Brouillette, David Danovitch, Luc Belanger, Peter A. Gruber
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
A new wafer bumping technology is described that is especially suited for Pb-free applications. Although capable of using standard PbSn eutectic solder, IMS (injection molded solder) has been found to be especially suited for accommodating a wide ran
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82e22fded659045fa43ca70fee311e20
https://doi.org/10.1109/ectc.2004.1319407
https://doi.org/10.1109/ectc.2004.1319407
Publikováno v:
Scandinavian Journal of Immunology. 8:213-218
This is a preliminary report on methods being developed for the isolation of rat AFP messenger RNA and the synthesis of DNA complementary to this mRNA. Using Morris hepatoma 7777 as source material, AFP-synthesizing polysomes have been isolated by in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8824f6c94e917784f09521dc607f170
https://doi.org/10.1111/j.1365-3083.1978.tb03923.x
https://doi.org/10.1111/j.1365-3083.1978.tb03923.x