Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Louie Huang"'
Autor:
Hong-Yi Yang, Ikai Lo, Cheng-Da Tsai, Ying-Chieh Wang, Huei-Jyun Shih, Hui-Chun Huang, Mitch M. C. Chou, Louie Huang, Terence Wang, Ching T. C. Kuo
Publikováno v:
Crystals, Vol 10, Iss 10, p 899 (2020)
Lattice relaxation on wurtzite GaN microdisks grown by plasma-assisted molecular beam epitaxy was systematically studied. The lattice constants of GaN microdisks were evaluated from high-resolution transmission electron microscopy, and the anisotropi
Externí odkaz:
https://doaj.org/article/c1641176122f48768e2ac50a737df302
Autor:
ChengDa Tsai, Ikai Lo, YingChieh Wang, ChenChi Yang, HongYi Yang, HueiJyun Shih, HuiChun Huang, Mitch M. C. Chou, Louie Huang, Binson Tseng
Publikováno v:
Crystals, Vol 9, Iss 6, p 308 (2019)
Indium-incorporation with InxGa1-xN layers on GaN-microdisks has been systematically studied against growth parameters by plasma-assisted molecular beam epitaxy. The indium content (x) of InxGa1-xN layer increased to 44.2% with an In/(In + Ga) flux r
Externí odkaz:
https://doaj.org/article/b1fc30921d924dd98a1f839c9b62b75d
Autor:
Ying-Chieh Wang, Hong-Yi Yang, Ikai Lo, Cheng-Da Tsai, Huei-Jyun Shih, Hui-Chun Huang, Mitch M. C. Chou, Louie Huang, Terence Wang, Ching T. C. Kuo
Publikováno v:
Recent Progress in Chemical Science Research Vol. 6 ISBN: 9788119054039
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21935ba31bf09dad851dce402817b989
https://doi.org/10.9734/bpi/rpcsr/v6/3062c
https://doi.org/10.9734/bpi/rpcsr/v6/3062c
Autor:
Ching T. C. Kuo, Louie Huang, Terence Wang, Hui-Chun Huang, Ying-Chieh Wang, Cheng-Da Tsai, H. D. Yang, Mitch M.C. Chou, Huei-Jyun Shih, Ikai Lo
Publikováno v:
Crystals
Volume 10
Issue 10
Crystals, Vol 10, Iss 899, p 899 (2020)
Volume 10
Issue 10
Crystals, Vol 10, Iss 899, p 899 (2020)
Lattice relaxation on wurtzite GaN microdisks grown by plasma-assisted molecular beam epitaxy was systematically studied. The lattice constants of GaN microdisks were evaluated from high-resolution transmission electron microscopy, and the anisotropi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::49ebc967d4e3b53ae0b31333a4954f05
Autor:
Hui-Chun Huang, Huei-Jyun Shih, Mitch M.C. Chou, Binson Tseng, Ikai Lo, Ying-Chieh Wang, Louie Huang, Cheng-Da Tsai, Chen-Chi Yang, H. D. Yang
Publikováno v:
Crystals, Vol 9, Iss 6, p 308 (2019)
Crystals
Volume 9
Issue 6
Crystals
Volume 9
Issue 6
Indium-incorporation with InxGa1-xN layers on GaN-microdisks has been systematically studied against growth parameters by plasma-assisted molecular beam epitaxy. The indium content (x) of InxGa1-xN layer increased to 44.2% with an In/(In + Ga) flux r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8c249655628bfcb4912b2a710672394b
https://www.mdpi.com/2073-4352/9/6/308
https://www.mdpi.com/2073-4352/9/6/308
Publikováno v:
International Symposium on Microelectronics. 2016:000106-000110
In this paper, the solder joint failure and the solder joint fatigue life in the Thin-profile Fine-pitch Ball Grid Array (TFBGA) Package was investigated by performing the drop test, and implementing a simulation model. Owing to the need to meet the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30e1f64c8362563abb02a4041d83dadc
https://doi.org/10.4071/isom-2016-tp52
https://doi.org/10.4071/isom-2016-tp52
Autor:
Louie Huang, Victor Shih
Publikováno v:
China Business Review. May/Jun2006, Vol. 33 Issue 3, p30-35. 6p.
Autor:
Kwang-Lung Lin, Ping-Feng Yang, Chih-Pin Hung, Tzu-Hsing Chiang, Louie Huang, Shoji Uegaki, Ying-Ta Chiu
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
The present article investigated the performance and corrosion behavior between Ag alloy wire bond and Al pad under molding compounds of different chlorine contents. The epoxy molding compounds (EMCs) were categorized as ultra-high chlorine, high chl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f64a750e669309943ca2d829fe8d8e86
https://doi.org/10.1109/icep.2016.7486877
https://doi.org/10.1109/icep.2016.7486877
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Recently, Cu wire is the most economic and major material on package wire bonding. The key factor of affecting aging test performance is IMC, which Cu wire reacts with Al pad. Because of various and advanced device development, the IMC of different C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::678eecbaa8ccd78ddde8fc60a631a853
https://doi.org/10.1109/ectc.2015.7159782
https://doi.org/10.1109/ectc.2015.7159782
Autor:
Sylvia Sutiono, Don Syth An, Jason Hung, Murali Sarangapani, Zhangxi, Frank Lin, Louie Huang, Tok Chee Wei
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Cu wire bonding has matured much over the years with improvements made not only to the Cu bonding process and optimization methodologies from bonder manufacturers, but also on capillaries and Cu wire itself. It is also part of the roadmap of many ass
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5da332cd78107a415c80d6767b6092c4
https://doi.org/10.1109/eptc.2014.7028261
https://doi.org/10.1109/eptc.2014.7028261