Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Lou Nicholls"'
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
The importance of the mechanical behavior of electronic packages starts at the beginning of the package assembly process and continues through performance testing procedures at different levels. Predicting an electronic package's mechanical performan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ebb866229725b9fd2cbd24f2d71b1b3a
https://doi.org/10.1109/ectc.2017.249
https://doi.org/10.1109/ectc.2017.249
Autor:
Ahmer Syed, Robert Francis Darveaux, Karthikeyan Dhandapani, Lou Nicholls, Christopher J. Berry, Robert Moody
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2010:001443-001464
Electromigration failure in flip-chip bumps has emerged as a major reliability concern due to potential elimination of Pb from flip-chip bumps and a continuous drive to increased IO density resulting in a reduction of bump size and pitch. Traditional
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a108faedcf304f6ec2dd00a3f01af5cc
https://doi.org/10.4071/2010dpc-wa33
https://doi.org/10.4071/2010dpc-wa33
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Ultra-high density chips are required for higher device performance, lower power consumption and a smaller form factor device. The interconnection between the chip and integrated circuit (IC) reflect these higher densities, smaller feature size can i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2758afe66fe976c2c17685b4e38fe4ae
https://doi.org/10.1109/ectc.2015.7159562
https://doi.org/10.1109/ectc.2015.7159562
Autor:
Dongjoo Park, Shengmin Wen, Choonheung Lee, Jinseong Kim, Juhoon Yoon, Byoungwoo Cho, Yesul Ahn, Gyuwan Han, Lou Nicholls
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Due to rapid growth in the mobile industry, Package-on-Package (PoP) has been widely adopted for 3D integration of logic and memory devices within mobile handsets, and other portable multimedia products, etc. Typical PoP configuration includes a logi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4fa3a8ba436ad58a168cc8d8417c19b8
https://doi.org/10.1109/ectc.2014.6897469
https://doi.org/10.1109/ectc.2014.6897469
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Failures due to Electromigration (EM) in flip-chip bumps have emerged as a major reliability concern due to potential elimination of Pb from flip-chip bumps and a continuous drive to increased IO density resulting in a reduction of bump pitch and siz
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::194f7f0333b9704c088457f49ea05947
https://doi.org/10.1109/ectc.2011.5898534
https://doi.org/10.1109/ectc.2011.5898534
Autor:
Shane Loo, Ahmer Syed, Tong Yan Tee, Thomas A. Wassick, Robert Francis Darveaux, Bill Batchelor, Lou Nicholls
Publikováno v:
2009 59th Electronic Components and Technology Conference.
For the past several years, the semiconductor industry has been responding to the RoHS directive to eliminate certain hazardous substances from electronic components. One of the areas where work is still ongoing to comply is in the area of flip chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7ebe00d71e008612876e047dc1d260e
https://doi.org/10.1109/ectc.2009.5074122
https://doi.org/10.1109/ectc.2009.5074122
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
Flip-chip packages have become the preferred solution for high-performance ASIC and microprocessor devices. Typically these are packaged in organic or ceramic ball grid array (BGA) connections. Recently, there has been a significant focus on Pb-free
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57ab3816f7769f3c6c165af86ffd6913
https://doi.org/10.1109/ectc.2007.373768
https://doi.org/10.1109/ectc.2007.373768
Publikováno v:
56th Electronic Components and Technology Conference 2006.
In the area of flip chip, even with high I/O ASICs, the die area has been large enough to support the I/O requirements using a 200-225 /spl mu/m pitch. In this range of bump pitches, there is a considerable base of data and experience. As the industr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b66e13a5a894a3452561a56372c027b6
https://doi.org/10.1109/ectc.2006.1645636
https://doi.org/10.1109/ectc.2006.1645636