Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Lothar Dietrich"'
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
Trials were made for thermocompression bonding of gold contacts with different geometries. Prior to bonding, the surfaces were mechanically planarized and activated by means of an atmospheric plasma. These treatments enabled excellent shear strengths
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce7e7f0401b0d291b194af80452085f5
https://doi.org/10.1109/estc.2018.8546419
https://doi.org/10.1109/estc.2018.8546419
Autor:
G. Engelmann, M. Klein, M. J. Wolf, Lothar Dietrich, B. Bramer, T. Fritzsch, Hermann Oppermann, R Dudek, Matthias Hutter, Herbert Reichl
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:359-366
Lead-free reflow soldering techniques applying AuSn as well as SnAg electroplated bumps were chosen for the evaluation of the flip-chip-bonding process for X-ray pixel detectors. Both solders can be used in pick-and-place processes with a subsequent
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::128032eb19d4b14d87dbe6a0a4ad41ab
https://doi.org/10.1109/tcpmt.2011.2108299
https://doi.org/10.1109/tcpmt.2011.2108299
Publikováno v:
Scopus-Elsevier
Pure metal contacts offer some advantage as high thermal and electrical conductivity, ductile deformation behavior and reduction of mechanical peak stresses. They are used in flip chip assemblies as gold bumps, in die attach as sintered silver powder
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::aa55ba412ce407cf853253b41ed50be0
https://doi.org/10.4071/2010dpc-tha31
https://doi.org/10.4071/2010dpc-tha31
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment. 565:290-295
Flip chip technology is a key driver for new complex system architectures and high-density packaging, e.g. sensor or pixel devices. Bumped wafers/dice as key elements become very important in terms of general availability at low cost, high yield and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa0a75ae60ac0bde068e1015b5a7bc4a
https://doi.org/10.1016/j.nima.2006.05.046
https://doi.org/10.1016/j.nima.2006.05.046
Autor:
Lothar Dietrich, Wolfgang Schirra
'Bessere Leistung zu niedrigeren Kosten.'Das gilt mittlerweile auch für die Informationstechnologie im Unternehmen. Dabei steigt die Komplexität der Anforderungen, weil Prozesse weltweit ausgerichtet werden müssen und die Veränderungsgeschwindigk
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Due to various advantages, as high efficiency, compactness and color variability, high brightness LEDs become more and more important for several lighting applications. In this paper, we discuss a completely new packaging approach of ultra thin high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d873abb7b7d7cb5dd29e8feaf788c8d
https://doi.org/10.1109/ectc.2013.6575730
https://doi.org/10.1109/ectc.2013.6575730
Autor:
Lothar Dietrich, Hermann Oppermann
Nanoporous gold bumps have been deposited on silicon wafers by electroplating a silver–gold alloy followed by etching the silver. An open-porous cellular structure of gold at meso-scale is left on top of the bumps. For flip chip bonding we found lo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8f4c690d19a711d475df7c27312ef406
https://publica.fraunhofer.de/handle/publica/228012
https://publica.fraunhofer.de/handle/publica/228012
Autor:
Froilan Molina, Tomotaka Tabuchi, Sven Spiller, I. Kuna, Lothar Dietrich, Thorsten Fischer, Julia Roder, Florian Bieck, Michael Topper, Christina Lopper
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
This paper presents a new carrierless approach to handling and processing ultra-thin Silicon which is predominantly used in processing Through Silicon Via (TSV) wafers. Currently, the state of the art consists of bonding the wafers having the vias on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b83e0b32fa4292d4fe3c1b6540a39a0
https://doi.org/10.1109/eptc.2010.5702703
https://doi.org/10.1109/eptc.2010.5702703
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8038fb900d183c45e3b681f8fcc487ba
https://doi.org/10.1109/estc.2010.5643002
https://doi.org/10.1109/estc.2010.5643002
Autor:
Herbert Reichl, Hermann Oppermann, M. Klein, Bruno Michel, R. Schacht, Bernhard Wunderle, R. Mrossko, D. May, Lothar Dietrich, M. Abo Ras
Publikováno v:
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
As the demand for new thermal technologies and materials has been increasing over the years to provide thermal solutions to the next generation of power electronics, microprocessors and high-power optical systems also thermal characterisation methods
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4feb28bd4ade8031f08f18ac0ba9edd4
https://doi.org/10.1109/itherm.2010.5501343
https://doi.org/10.1109/itherm.2010.5501343